Inventor
Enrico Herz
Inventor
Frauendorf, DE
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering27%
H05KPrinted circuits27%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
Y10TTechnical subjects covered by former us classification20%
H01LSemiconductor devices7%
PatentTitleYear
9,254,533'Removing material from defective opening in glass mold'20168,800,952'Removing material from defective opening in glass mold and related glass mold for injection molded solder'20148,237,086'Removing material from defective opening in glass mold'20128,044,320'Method and apparatus for the correction of defective solder bump arrays'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2016Patents assigned to HERZ ENRICO (4)· patent assignee history
2011–2016Patents assigned to TEICH MICHAEL (4)· patent assignee history
2011–2016Based in Frauendorf, DE· patent location history
2012–2016Patents assigned to COHEN JEROME D (3)· patent assignee history
2012–2016Patents assigned to HAAS ROBERT G (3)· patent assignee history
2012–2016Patents assigned to TESSLER CHRISTOPHER L (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HERZ ENRICOself | 4 | 2011–2016 |
| TEICH MICHAEL | 4 | 2011–2016 |
| COHEN JEROME D | 3 | 2012–2016 |
| HAAS ROBERT G | 3 | 2012–2016 |
| TESSLER CHRISTOPHER L | 3 | 2012–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Frauendorf, DE | 4 | 2011–2016 |