Inventor
Masayasu Nihei
Inventor
Hitachi, JP
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering26%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
C23CCoating metallic material16%
H01JElectric discharge tubes or discharge lamps16%
G06TImage data processing or generation, in general5%
H01RElectrically-conductive connections5%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
Y10TTechnical subjects covered by former us classification5%
PatentTitleYear
6,225,598'Method of high frequency pulse arc welding and apparatus therefor'20015,767,577'Method of solder bonding and power semiconductor device manufactured by the method'19985,175,608'Method of and apparatus for sputtering, and integrated circuit device'19925,051,812'Semiconductor device and method for manufacturing the same'19914,999,096'Method of and apparatus for sputtering'19914,692,230'Thin film forming method through sputtering and sputtering device'19874,436,982'Two electrode welding with different currents supplied to the electrodes'19844,396,823'Method of electrode current control in welding apparatus having a plurality of electrodes'19834,280,137'Method and apparatus for automatically controlling arc welding'1981Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1981–2001Patents assigned to HITACHI LTD (9)· patent assignee history
1981–2001Based in Hitachi, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 9 | 1981–2001 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hitachi, JP | 9 | 1981–2001 |