Inventor
RAMANAN CHEBIAM
Inventor
US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices35%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
H04BTransmission10%
PatentTitleYear
12,482,744Subtractively patterned interconnect structures for integrated circuits202512,394,716Integrated circuit interconnect structures with graphene cap202512,027,458Subtractively patterned interconnect structures for integrated circuits202411,887,887Interconnect structures and methods of fabrication202411,532,558Metallization barrier structures for bonded integrated circuit interfaces202211,444,024Subtractively patterned interconnect structures for integrated circuits202211,404,307Interconnect structures and methods of fabrication2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to INTEL CORP (7)· patent assignee history
2022–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 7 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 7 | 2022–2025 |