Inventor
Stephan Bradl
Inventor
Regensburg, DE
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1027%
H01LSemiconductor devices9%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
B05DProcesses for applying fluent materials to surfaces, in general3%
B24BMachines, devices, or processes for grinding or polishing3%
C09GPolishing compositions3%
C09KMaterials for miscellaneous applications, not provided for elsewhere3%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices3%
G11CStatic stores3%
PatentTitleYear
10,566,309Multi-purpose non-linear semiconductor package assembly line20209,601,475'Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips'20179,293,423'Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips'20168,759,230'Treatment of a substrate with a liquid medium'20148,309,454'Structure for electrostatic discharge in embedded wafer level packages'20128,173,534'Method for producing a semiconductor wafer with rear side identification'20127,911,036'Semiconductor wafer with rear side identification and method'20117,906,860'Semiconductor device'20117,902,062'Electrodepositing a metal in integrated circuit applications'20117,759,792'Integrated circuit including parylene material layer'20107,687,895'Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips'20107,566,378'Arrangement of electronic semiconductor components on a carrier system for treating said semiconductor components with a liquid medium'20096,459,296'Method, system and method of using a component for setting the electrical characteristics of microelectronic circuit configurations'20026,447,372'Polishing agent for semiconductor substrates'20026,337,255'Method for forming a trench structure in a silicon substrate'20026,086,269'Method and apparatus for applying a substance to a surface'20006,014,218'Device and method for end-point monitoring used in the polishing of components, in particular semiconductor components'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000Patents assigned to SIEMENS AG (2)· patent assignee history
2000Based in Dresden, DE· patent location history
2000Based in Kofering, DE· patent location history
2002–2020Patents assigned to INFINEON TECHNOLOGIES AG (12)· patent assignee history
2002Based in Kfering, DE· patent location history
2009–2020Based in Regensburg, DE· patent location history
2011Based in Köfering, DE· patent location history
2012–2014Patents assigned to BRADL STEPHAN (3)· patent assignee history
2012–2016Patents assigned to INTEL MOBILE COMM GMBH (2)· patent assignee history
2016–2017Patents assigned to INTEL DEUTSCHLAND GMBH (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 12 | 2002–2020 |
| BRADL STEPHANself | 3 | 2012–2014 |
| INTEL DEUTSCHLAND GMBH | 2 | 2016–2017 |
| INTEL MOBILE COMM GMBH | 2 | 2012–2016 |
| SIEMENS AG | 2 | 2000 |
Locations
| Location | Patents | Span |
|---|---|---|
| Regensburg, DE | 11 | 2009–2020 |
| Kfering, DE | 3 | 2002 |
| Köfering, DE | 1 | 2011 |
| Dresden, DE | 1 | 2000 |
| Kofering, DE | 1 | 2000 |