Inventor

Yeong Gyu Lee

Inventor

Suwon-si, KR

Overview

2000–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 27 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H03Hprimary

H03HImpedance networks, e.g. resonant circuits21%

B81BMicrostructural devices or systems, e.g. micromechanical devices16%

G02BOptical elements, systems or apparatus14%

B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems12%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%

H01LSemiconductor devices4%

H05KPrinted circuits4%

H10NElectric solid-state devices not otherwise provided for4%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%

Y10TTechnical subjects covered by former us classification4%

PatentTitleYear

10,790,798Acoustic resonator and method for manufacturing the same2020 10,715,098Acoustic resonator package2020 10,693,438Acoustic wave resonator and method for manufacturing the same2020 10,637,428Acoustic wave device and method of manufacturing the same2020 10,511,281Acoustic wave resonator and filter including the same2019 10,367,471Resonator package and method of manufacturing the same2019 10,329,142Wafer level package and method of manufacturing the same2019 10,277,196Bulk acoustic wave resonator and method for manufacturing the same2019 10,263,598Acoustic resonator and method of manufacturing the same2019 10,069,472Bulk acoustic wave resonator and filter including the same2018 9,998,094Bulk acoustic wave resonator having a frame spaced apart from an electrode2018 9,929,716'Acoustic resonator and method of manufacturing the same'2018 9,787,280'Acoustic resonator and method of manufacturing the same'2017 8,505,190'Method of manufacturing inertial sensor'2013 7,443,024'Micro-electro-mechanical system (MEMS) package having side double-sealing member and method of manufacturing the same'2008 7,394,139'Optical modulator module package using flip-chip mounting technology'2008 7,388,282'Micro-electro-mechanical system (MEMS) package having hydrophobic layer'2008 7,343,072'Light modulator package having inclined light transmissive lid'2008 7,227,267'Semiconductor package using flip-chip mounting technique'2007 7,116,456'Light modulator module package'2006 7,098,535'Semiconductor package and packaging method using flip-chip bonding technology'2006 7,078,804'Micro-electro-mechanical system (MEMS) package with side sealing member and method of manufacturing the same'2006 6,915,033'Multi-channel optical switch and method for manufacturing the same'2005 6,526,199'Arrayed waveguide grating wavelength division multiplexer provided with alignment waveguides and apparatus for aligning the same'2003 6,278,814'1.times.N optical wavelength-division demultiplexer alignment apparatus and 1.times.N optical wavelength-division demultiplexer therefor'2001 6,175,675'Apparatus for aligning and method of bonding optical waveguide device to optical fiber block'2001 6,012,856'Method and article for splicing optical fibers coated with metal and reinforced splice formed thereby'2000

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2000–2003Patents assigned to SAMSUNG ELECTRONICS CO LTD (4)· patent assignee history

2000–2020Based in Suwon-si, KR· patent location history

2005–2020Patents assigned to SAMSUNG ELECTRO MECH (23)· patent assignee history

2005–2013Based in Kyungki-do, KR· patent location history

2007–2008Based in Gyeonggi-do, KR· patent location history

2013Patents assigned to LEE HYUN KEE (1)· patent assignee history

2013Patents assigned to LEE YEONG GYU (1)· patent assignee history

2013Patents assigned to PARK HEUNG WOO (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SAMSUNG ELECTRO MECH	23	2005–2020
SAMSUNG ELECTRONICS CO LTD	4	2000–2003
LEE HYUN KEE	1	2013
LEE YEONG GYUself	1	2013
PARK HEUNG WOO	1	2013

Locations

Location	Patents	Span
Suwon-si, KR	17	2000–2020
Kyungki-do, KR	5	2005–2013
Gyeonggi-do, KR	5	2007–2008