Inventor
Uri Cohen
Inventor
Palo Alto, CA, US
Overview
Patents· 54 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
G11BInformation storage based on relative movement between record carrier and transducer16%
Y10TTechnical subjects covered by former us classification13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
C25DProcesses for the electrolytic or electrophoretic production of coatings8%
C04BLime, magnesia6%
H01FMagnets4%
H05KPrinted circuits4%
H01LSemiconductor devices4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
PatentTitleYear
10,096,547Metallic interconnects products20189,911,614'Methods for activating openings for jets electroplating'20189,673,090'Seed layers for metallic interconnects'20179,530,653'High speed electroplating metallic conductors'20169,278,890'Continuous process for manufacturing freely flowing solid acidic P/K fertilizer'20169,273,409'Electroplated metallic conductors'20169,216,930'Continuous process for manufacturing a neutral granular P/K fertilizer'20159,161,272'Method and apparatus to achieve lossless call in view of a temporary reception issue'20158,685,221'Enhanced electrochemical deposition filling'20148,603,242'Floating semiconductor foils'20138,586,471'Seed layers for metallic interconnects and products'20138,501,139'Floating Si and/or Ge foils'20138,349,149'Apparatus for enhanced electrochemical deposition'20138,123,861'Apparatus for making interconnect seed layers and products'20127,709,958'Methods and structures for interconnect passivation'20107,682,496'Apparatus for depositing seed layers'20107,573,133'Interconnect structures and methods for their fabrication'20097,550,386'Advanced seed layers for interconnects'20097,282,445'Multiple seed layers for interconnects'20077,247,563'Filling high aspect ratio openings by enhanced electrochemical deposition (ECD)'20077,199,052'Seed layers for metallic interconnects'20077,105,434'Advanced seed layery for metallic interconnects'20066,924,226'Methods for making multiple seed layers for metallic interconnects'20056,903,016'Combined conformal/non-conformal seed layers for metallic interconnects'20056,869,515'Enhanced electrochemical deposition (ECD) filling of high aspect ratio openings'20056,635,184'Method for pattern-etching alumina layers and products'20036,610,151'Seed layers for interconnects and methods and apparatus for their fabrication'20036,518,668'Multiple seed layers for metallic interconnects'20036,391,212'Method for etching gap-vias in a magnetic thin film head and product'20026,195,232'Low-noise toroidal thin film head with solenoidal coil'20016,136,707'Seed layers for interconnects and methods for fabricating such seed layers'20006,059,984'Process for fabricating thin film magnetic head including crater for recessed structure'20005,995,342'Thin film heads having solenoid coils'19995,945,007'Method for etching gap-vias in a magnetic thin film head and product'19995,888,411'Pinched-gap magnetic recording thin film head'19995,835,315'Wafer including scribe line grooves for separating thin film heads and process for making the same'19985,820,770'Thin film magnetic head including vias formed in alumina layer and process for making the same'19985,745,980'Method of fabricating magnetic recording thin film head having pinched-gap'19985,703,740'Toroidal thin film head'19975,673,163'Pinched-gap magnetic recording thin film head'19975,659,451'Studless thin film magnetic head and process for making the same'19975,657,192'Thin film magnetic head including crater for recessed structure and process for making the same'19975,650,897'Thin film magnetic head including lightning arrester and process for making the same'19975,621,595'Pinched-gap magnetic recording thin film head'19975,421,987'Precision high rate electroplating cell and method'19955,326,429'Process for making studless thin film magnetic head'19945,200,056'Method for aligning pole tips in a thin film head'19935,141,623'Method for aligning pole tips in a thin film head'19925,059,278'Selective chemical removal of coil seed-layer in thin film head magnetic transducer'19914,923,574'Method for making a record member with a metallic antifriction overcoat'19904,678,722'Record member with metallic antifriction overcoat'19874,269,671'Electroplating of silver-palladium alloys and resulting product'19814,142,947'Electrodeposition of polycrystalline silicon from a molten fluoride bath and product'19793,983,012'Epitaxial growth of silicon or germanium by electrodeposition from molten salts'1976Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1979–2018Patents assigned to COHEN URI (23)· patent assignee history
1979Based in North Plainfield, NJ, US· patent location history
1981Patents assigned to BELL TELEPHONE LABOR INC (1)· patent assignee history
1981Based in Haifa, IL· patent location history
1987–2018Based in Palo Alto, CA, US· patent location history
1991–2000Patents assigned to SEAGATE TECHNOLOGY (10)· patent assignee history
1999–2001Patents assigned to TOROHEAD INC (2)· patent assignee history
2015–2016Patents assigned to ROTEM AMFERT NEGEV LTD (2)· patent assignee history
2015–2016Based in Metar, IL· patent location history
2015Based in Ramat Gan, IL· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| COHEN URIself | 23 | 1979–2018 |
| SEAGATE TECHNOLOGY | 10 | 1991–2000 |
| ROTEM AMFERT NEGEV LTD | 2 | 2015–2016 |
| TOROHEAD INC | 2 | 1999–2001 |
| BELL TELEPHONE LABOR INC | 1 | 1981 |
Locations
| Location | Patents | Span |
|---|---|---|
| Palo Alto, California, US | 48 | 1987–2018 |
| Metar, IL | 2 | 2015–2016 |
| Ramat Gan, IL | 1 | 2015 |
| Haifa, IL | 1 | 1981 |
| North Plainfield, New Jersey, US | 1 | 1979 |