Inventor
Yonggang Jin
Inventor
Singapore, SG
Overview
Patents· 36 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%
H01LSemiconductor devices19%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
Y10TTechnical subjects covered by former us classification6%
G01SRadio direction-finding4%
G06TImage data processing or generation, in general3%
G06VImage or video recognition or understanding3%
H03KPulse technique3%
B23KSoldering or unsoldering2%
PatentTitleYear
10,878,621Method and apparatus for creating map and positioning moving entity202010,846,543Method and apparatus for detecting lane line, and medium202010,789,771Method and apparatus for fusing point cloud data202010,381,504Wafer level packaging, optical detection sensor and method of forming same201910,128,207Semiconductor packages with pillar and bump structures201810,115,842Semiconductor optical package and method20189,991,409Wafer level packaging, optical detection sensor and method of forming same20189,851,328Compact microelectronic integrated gas sensor20179,831,357Semiconductor optical package and method20179,780,080'Method for making an optical proximity sensor by attaching an optical element to a package top plate and forming a package body to define an optical transmit cavity and an optical receive cavity'20179,455,241'Integrated circuit package and method of forming the same'20169,448,216'Gas sensor device with frame passageways and related methods'20169,252,030'System-in-packages and methods for forming same'20169,059,058'Image sensor device with IR filter and related methods'20159,018,645'Optoelectronics assembly and method of making optoelectronics assembly'20159,013,037'Semiconductor package with improved pillar bump process and structure'20159,012,269'Reducing warpage for fan-out wafer level packaging'20159,013,017'Method for making image sensors using wafer-level processing and associated devices'20158,937,008'Apparatus and method for placing solder balls'20158,916,481'Embedded wafer level package for 3D and package-on-package applications, and method of manufacture'20148,912,653'Plasma treatment on semiconductor wafers'20148,860,207'Method of fabricating land grid array semiconductor package'20148,860,228'Electronic device including electrically conductive vias having different cross-sectional areas and related methods'20148,836,117'Electronic device having a contact recess and related methods'20148,796,139'Embedded wafer level ball grid array bar systems and methods'20148,779,601'Embedded wafer level package for 3D and package-on-package applications, and method of manufacture'20148,766,422'Through hole via filling using electroless plating'20148,728,831'Reconstituted wafer warpage adjustment'20148,664,044'Method of fabricating land grid array semiconductor package'20148,617,987'Through hole via filling using electroless plating'20138,535,980'Method for producing vias in fan-out wafers using dry film and conductive paste, and a corresponding semiconductor package'20138,349,710'Shielding techniques for an integrated circuit'20138,119,454'Manufacturing fan-out wafer level packaging'20127,443,039'System for different bond pads in an integrated circuit package'20087,306,133'System for fabricating an integrated circuit package on a printed circuit board'20077,005,370'Method of manufacturing different bond pads on the same substrate of an integrated circuit package'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2019Based in Singapore, SG· patent location history
2012–2015Patents assigned to JIN YONGGANG (13)· patent assignee history
2012–2015Patents assigned to ST MICROELECTRONICS ASIA (4)· patent assignee history
2013–2019Patents assigned to ST MICROELECTRONICS PTE LTD (29)· patent assignee history
2013–2014Patents assigned to GAN KAH WEE (6)· patent assignee history
2013–2014Patents assigned to HUANG YAOHUANG (4)· patent assignee history
2020Based in Beijing, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ST MICROELECTRONICS PTE LTD | 29 | 2013–2019 |
| JIN YONGGANGself | 13 | 2012–2015 |
| GAN KAH WEE | 6 | 2013–2014 |
| HUANG YAOHUANG | 4 | 2013–2014 |
| ST MICROELECTRONICS ASIA | 4 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Singapore, SG | 33 | 2006–2019 |
| Beijing, CN | 3 | 2020 |