Inventor
Armando S. Cammarano
Inventor
Hyde Park, NY, US
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1042%
H05KPrinted circuits21%
Y10TTechnical subjects covered by former us classification16%
B23KSoldering or unsoldering11%
C22CAlloys5%
G01RMeasuring electric variables5%
PatentTitleYear
6,049,456'Electronic module adjustment design and process using shims'20005,881,944'Multi-layer solder seal band for semiconductor substrates'19995,881,945'Multi-layer solder seal band for semiconductor substrates and process'19995,442,239'Structure and method for corrosion and stress-resistant interconnecting metallurgy'19955,266,522'Structure and method for corrosion and stress-resistant interconnecting metallurgy'19935,192,622'Low-cost ternary composite for use in vias in glass-ceramic structures'19935,175,609'Structure and method for corrosion and stress-resistant interconnecting metallurgy'19924,465,223'Process for brazing'19844,360,289'Pin for brazing to a substrate and improved package resulting therefrom'19824,272,722'Determination of electric current flow patterns'1981Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1981–2000Patents assigned to IBM (10)· patent assignee history
1981–2000Based in Hyde Park, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 10 | 1981–2000 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hyde Park, New York, US | 10 | 1981–2000 |