Inventor

Osamu Kuwabara

Inventor

Tokyo, JP

Overview

20→

Patents

1990–2013

Patent span

Electricity

Primary field (CPC H)

Patents· 20 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%

F25BRefrigeration machines, plants or systems10%

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices10%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%

H05KPrinted circuits5%

H10DInorganic electric semiconductor devices5%

Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications5%

B41JTypewriters3%

B60HArrangements of heating, cooling, ventilating or other air-treating devices specially adapted for passenger or goods spaces of vehicles3%

D06FLaundering, drying, ironing, pressing or folding textile articles3%

PatentTitleYear

8,584,479'Air conditioner having a desiccant rotor with moisture adsorbing area'2013 8,347,520'Drying unit and laundry washing/drying machine equipped with the drying unit'2013 8,154,133'Semiconductor device having low dielectric constant film and manufacturing method thereof'2012 7,944,064'Semiconductor device having alignment post electrode and method of manufacturing the same'2011 7,863,750'Semiconductor device capable of suppressing warping in a wafer state and manufacturing method thereof'2011 7,631,510'Multi-stage refrigeration system including sub-cycle control characteristics'2009 7,104,079'Heat pump'2006 6,889,512'On-vehicle air conditioner'2005 6,601,773'Heat pump type hot water supply apparatus'2003 6,603,191'Semiconductor device and method of manufacturing the same'2003 6,600,234'Mounting structure having columnar electrodes and a sealing film'2003 6,472,249'Semiconductor device having sealing film formed on the surface having columnar electrode formed thereon and method of manufacturing the same'2002 6,319,851'Method for packaging semiconductor device having bump electrodes'2001 5,378,859'Film wiring board'1995 5,195,113'X-ray exposure apparatus and method of positioning the same'1993 5,148,189'Thermal print head'1992 5,134,640'Synchrotron radiation apparatus'1992 5,025,348'Bonding structure of an electronic device and a method for manufacturing the same'1991 4,984,890'Method and an apparatus for aligning first and second objects with each other'1991 4,902,133'Method and an apparatus for aligning first and second objects with each other'1990

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1990–1993Patents assigned to TOSHIBA KK (4)· patent assignee history

1990–1991Patents assigned to TOKYO OPTICAL (2)· patent assignee history

1990–1993Based in Yokohama, JP· patent location history

1991–2012Patents assigned to CASIO COMPUTER CO LTD (10)· patent assignee history

1991–2012Based in Tokyo, JP· patent location history

2003–2013Patents assigned to SANYO ELECTRIC CO (6)· patent assignee history

2003–2013Based in Gunma, JP· patent location history

2009Based in Oizumi-machi, JP· patent location history

2012–2013Patents assigned to KUWABARA OSAMU (3)· patent assignee history

2013Based in Ora-gun, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
CASIO COMPUTER CO LTD	10	1991–2012
SANYO ELECTRIC CO	6	2003–2013
TOSHIBA KK	4	1990–1993
KUWABARA OSAMUself	3	2012–2013
TOKYO OPTICAL	2	1990–1991

Locations

Location	Patents	Span
Tokyo, JP	10	1991–2012
Yokohama, JP	4	1990–1993
Gunma, JP	3	2003–2013
Ora-gun, JP	1	2013
Oizumi-machi, JP	1	2009