Inventor
Casey J. Feinstein
Inventor
San Jose, CA, US
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
Y10Tprimary
Y10TTechnical subjects covered by former us classification20%
G06FElectric digital data processing13%
C03CChemical composition of glasses, glazes or vitreous enamels11%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form9%
B29CShaping or joining of plastics8%
C09JAdhesives5%
H05KPrinted circuits5%
B24BMachines, devices, or processes for grinding or polishing3%
G02BOptical elements, systems or apparatus3%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein3%
PatentTitleYear
9,944,554Perforated mother sheet for partial edge chemical strengthening and method therefor20189,615,448'Method for fabricating thin sheets of glass'20179,409,383'Layer-specific energy distribution delamination'20169,405,388'Full perimeter chemical strengthening of substrates'20169,213,451'Thin glass for touch panel sensors and methods therefor'20159,207,787'Full perimeter chemical strengthening of substrates'20159,063,605'Thin glass processing using a carrier'20159,046,684'Method for selectively treating surfaces'20158,946,561'Flexible circuitry with heat and pressure spreading layers'20158,944,659'Methods for assembling electronic devices using embedded light guide structures'20158,875,652'Liquid adhesive boundary control'20148,857,490'3-dimensional curved substrate lamination'20148,808,483'Method of making a curved touch panel'20148,673,163'Method for fabricating thin sheets of glass'20148,608,896'Liquid adhesive lamination for precision adhesive control'20138,196,636'3-dimensional curved substrate lamination'20128,123,894'3-dimensional curved substrate lamination'20127,810,355'Full perimeter chemical strengthening of substrates'20107,345,806'Method and apparatus for characterizing microelectromechanical devices on wafers'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008Based in San Francisco, CA, US· patent location history
2010–2018Patents assigned to APPLE INC (16)· patent assignee history
2010–2018Based in San Jose, CA, US· patent location history
2012–2018Patents assigned to FEINSTEIN CASEY J (11)· patent assignee history
2012–2016Patents assigned to SUNG KUO-HUA (7)· patent assignee history
2012–2018Patents assigned to ZHONG JOHN Z (7)· patent assignee history
2012–2015Patents assigned to FEINSTEIN CASEY (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLE INC | 16 | 2010–2018 |
| FEINSTEIN CASEY Jself | 11 | 2012–2018 |
| SUNG KUO-HUA | 7 | 2012–2016 |
| ZHONG JOHN Z | 7 | 2012–2018 |
| FEINSTEIN CASEYself | 4 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Jose, California, US | 18 | 2010–2018 |
| San Francisco, California, US | 1 | 2008 |