Inventor
WEN-HSI LEE
Inventor
TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices19%
H10DInorganic electric semiconductor devices19%
G06FElectric digital data processing12%
H10BElectronic memory devices12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
B82YSpecific uses or applications of nanostructures8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
C23CCoating metallic material4%
C25DProcesses for the electrolytic or electrophoretic production of coatings4%
H01GCapacitors4%
PatentTitleYear
12,464,790Semiconductor structure202512,289,877Semiconductor device including unilaterally extending gates and method of forming same202512,021,117Semiconductor structure and method of forming the same202411,844,205Semiconductor device including trimmed-gates and method of forming same202311,810,720Method for fabricating terminal electrode of multilayer ceramic capacitor having inner electrodes printed on full area together with protective layers202311,587,937Method of forming semiconductor device including trimmed-gates2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (5)· patent assignee history
2023–2025Patents assigned to UNIV NAT CHENG KUNG (3)· patent assignee history
2023–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 5 | 2023–2025 |
| UNIV NAT CHENG KUNG | 3 | 2023–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 6 | 2023–2025 |