Inventor
HOWARD E. CHEN
Inventor
US
Overview
Patents· 14 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices36%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H05KPrinted circuits15%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
B23KSoldering or unsoldering3%
H01QAntennas, i.e. radio aerials3%
PatentTitleYear
12,588,555Dual sided molded package with varying interconnect pad sizes and varying exposed solderable area202612,582,013Configurations for metal posts for dual side mold modules202612,431,445Methods related to dual-sided module with land-grid array (LGA) footprint202512,362,267Electronic package and method for manufacturing an electronic package202512,261,127Application of conductive via or trench for intra module EMI shielding202512,058,806Devices and methods related to metallization of ceramic substrates for shielding applications202412,033,954Packaged module with ball grid array and grounding pins for signal isolation, method of manufacturing the same, and wireless device comprising the same202411,961,805Devices and methods related to dual-sided radio-frequency package with overmold structure202411,894,323Devices related to dual-sided module with land-grid array (LGA) footprint202411,682,585Devices for fabrication of shielded modules202311,277,901Methods related to metallization of ceramic substrates for shielding applications202211,244,835Control of under-fill using a film during fabrication for a dual-sided ball grid array package202211,233,014Packaged module having a ball grid array with grounding shielding pins for electromagnetic isolation, method of manufacturing the same, and wireless device comprising the same202211,139,257Methods related to dual-sided module with land-grid array (LGA) footprint2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to SKYWORKS SOLUTIONS INC (14)· patent assignee history
2021–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SKYWORKS SOLUTIONS INC | 14 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 14 | 2021–2026 |