Inventor
HU KANG
Inventor
US
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C23Cprimary
C23CCoating metallic material30%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1030%
H01LSemiconductor devices23%
H01JElectric discharge tubes or discharge lamps10%
H10DInorganic electric semiconductor devices3%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h103%
PatentTitleYear
12,448,687Dynamic precursor dosing for atomic layer deposition202512,354,871Ultrathin atomic layer deposition film accuracy thickness control202512,261,038Gapfill of variable aspect ratio features with a composite PEALD and PECVD method202511,970,772Dynamic precursor dosing for atomic layer deposition202411,670,503Method of atomic layer deposition202311,646,198Ultrathin atomic layer deposition film accuracy thickness control202311,479,856Multi-cycle ALD process for film uniformity and thickness profile modulation202211,434,567Substrate processing system with tandem source activation for CVD202211,180,850Dynamic precursor dosing for atomic layer deposition2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to LAM RES CORP (9)· patent assignee history
2021–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LAM RES CORP | 9 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 9 | 2021–2025 |