Inventor
Qing Bai
Inventor
Sunnyvale, CA, US
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Mprimary
H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution17%
B61LGuiding railway traffic11%
H01BCables11%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems6%
H03BGeneration of oscillations, directly or by frequency-changing, by circuits employing active elements which operate in a non-switching manner6%
H03HImpedance networks, e.g. resonant circuits6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
Y02PClimate change mitigation technologies in the production or processing of goods6%
PatentTitleYear
11,056,717Lithium phosphate derivative compounds as Li super-ionic conductor, solid electrolyte and coating layer for lithium metal battery and lithium-ion battery202110,938,063Lithium silicate compounds as Li super-ionic conductor, solid electrolyte and coating layer for lithium metal battery and lithium-ion battery202110,923,763Lithium metal sulfides as lithium super ionic conductors, solid electrolyte and coating layer for lithium metal battery and lithium-ion battery20219,283,972'Networking operation dispatch system based on electronic zones for rail vehicle'20168,985,522'Method for improving operation density of rail vehicles and preventing head-on collision and rear-ending collision'20157,615,833'Film bulk acoustic resonator package and method of fabricating same'20097,554,177'Attachment system incorporating a recess in a structure'20097,294,919'Device having a complaint element pressed between substrates'20077,274,050'Packaging and manufacturing of an integrated circuit'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007Patents assigned to AVAGO TECHNOLOGIES GENERAL IP (2)· patent assignee history
2007–2009Based in Sunnyvale, CA, US· patent location history
2009Patents assigned to AVAGO TECHNOLOGIES WIRELESS IP (2)· patent assignee history
2015–2016Patents assigned to BAI JING (2)· patent assignee history
2015Based in Shanghai, CN· patent location history
2016Based in Shanxi, CN· patent location history
2021Patents assigned to TOYOTA ENG & MFG NORTH AMERICA (3)· patent assignee history
2021Patents assigned to UNIV MARYLAND (3)· patent assignee history
2021Based in College Park, MD, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOYOTA ENG & MFG NORTH AMERICA | 3 | 2021 |
| UNIV MARYLAND | 3 | 2021 |
| AVAGO TECHNOLOGIES GENERAL IP | 2 | 2007 |
| AVAGO TECHNOLOGIES WIRELESS IP | 2 | 2009 |
| BAI JING | 2 | 2015–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Sunnyvale, California, US | 4 | 2007–2009 |
| College Park, Maryland, US | 3 | 2021 |
| Shanxi, CN | 1 | 2016 |
| Shanghai, CN | 1 | 2015 |