Inventor

Hiroaki Fujiwara

Inventor

Nara, JP

Overview

1997–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 43 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits17%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%

Y10TTechnical subjects covered by former us classification8%

C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients7%

C08LCompositions of macromolecular compounds7%

C08JWorking-up7%

H01LSemiconductor devices7%

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds6%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form5%

Y02PClimate change mitigation technologies in the production or processing of goods5%

PatentTitleYear

10,870,721Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board2020 10,590,223Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board2020 10,518,589Pneumatic tire2019 10,240,015Modified polyphenylene ether, method for preparing same, polyphenylene ether resin composition, resin varnish, prepreg, metal-clad laminate and printed circuit board2019 10,047,213Method of curing thermosetting resin composition, thermosetting resin composition, and PREPREG, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used2018 9,795,033'Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same'2017 9,708,468'Thermosetting resin composition, prepreg, metal clad laminate plate, and printed wiring board'2017 9,637,598'Method of curing thermosetting resin composition, thermosetting resin composition, and prepreg, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used'2017 9,567,481'Resin composition, resin varnish, prepreg, metal-clad laminate and printed wiring board'2017 9,528,026'Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board'2016 9,351,402'Circuit board, and semiconductor device having component mounted on circuit board'2016 9,332,642'Circuit board'2016 9,332,650'Method of producing multilayer circuit board'2016 9,206,308'Epoxy resin composition for prepreg, prepreg, and multilayer printed circuit board'2015 9,204,530'Electronic components assembly'2015 9,175,151'Resin composition and method for producing circuit board'2015 9,082,635'Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module and multilayer circuit board'2015 9,082,825'Manufacturing method for semiconductor package, semiconductor package, and semiconductor device'2015 9,082,438'Three-dimensional structure for wiring formation'2015 9,070,393'Three-dimensional structure in which wiring is provided on its surface'2015 8,929,092'Circuit board, and semiconductor device having component mounted on circuit board'2015 8,901,728'Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same'2014 8,877,843'Resin composition and method for producing circuit board'2014 8,759,148'Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same'2014 8,698,003'Method of producing circuit board, and circuit board obtained using the manufacturing method'2014 8,530,123'Electrophotographic photoreceptor, electrophotographic photoreceptor cartridge, and image-forming apparatus'2013 8,516,145'Information processing method and information processing apparatus for transmitting data generated by device manufacturing apparatus'2013 8,482,137'Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same'2013 8,450,032'Electrophotographic photoreceptor, electrophotographic photoreceptor cartridge, and image-forming apparatus'2013 8,409,704'Prepreg, printed wiring board, multilayer circuit board, and process for manufacturing printed wiring board'2013 8,272,126'Method of producing circuit board'2012 8,240,036'Method of producing a circuit board'2012 8,065,270'Information processing system, information processing method, and memory medium'2011 8,060,472'Information processing system, information processing method, and computer-readable storage medium'2011 7,904,281'Mounting process simulation system and method thereof'2011 7,873,932'Method for analyzing component mounting board'2011 7,838,576'Poly (phenylene ether) resin composition, prepreg, and laminated sheet'2010 7,413,791'Poly (phenylene ether) resin composition, prepreg, and laminated sheet'2008 7,151,850'Apparatus and method for setting teaching data, teaching data providing system over network'2006 7,035,774'Portable terminal and message notifying system using the same'2006 6,962,252'Curved belt support apparatus'2005 6,665,854'Method and apparatus of checking mount quality of circuit board'2003 5,607,097'Component-mounted circuit board production system'1997

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1997–2006Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (4)· patent assignee history

1997–2011Based in Takatsuki, JP· patent location history

2011–2017Patents assigned to PANASONIC CORP (21)· patent assignee history

2011–2016Patents assigned to FUJIWARA HIROAKI (15)· patent assignee history

2011–2013Based in Utsunomiya, JP· patent location history

2012–2016Patents assigned to YOSHIOKA SHINGO (8)· patent assignee history

2012–2016Based in Ikoma, JP· patent location history

2014–2020Based in Nara, JP· patent location history

2015–2020Patents assigned to PANASONIC IP MAN CO LTD (9)· patent assignee history

2015–2019Based in Fukushima, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
PANASONIC CORP	21	2011–2017
FUJIWARA HIROAKIself	15	2011–2016
PANASONIC IP MAN CO LTD	9	2015–2020
YOSHIOKA SHINGO	8	2012–2016
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD	4	1997–2006

Locations

Location	Patents	Span
Nara, JP	16	2014–2020
Fukushima, JP	6	2015–2019
Ikoma, JP	6	2012–2016
Takatsuki, JP	5	1997–2011
Utsunomiya, JP	3	2011–2013