Inventor
JEN-CHIEH LAI
Inventor
TW
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices27%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1027%
B24BMachines, devices, or processes for grinding or polishing20%
H10DInorganic electric semiconductor devices10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
B25JManipulators3%
B65GTransport or storage devices, e.g. conveyors for loading or tipping, shop conveyor systems or pneumatic tube conveyors3%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
PatentTitleYear
12,409,529Vacuum assembly for chemical mechanical polishing202512,076,831Chemical mechanical polishing apparatus and method202412,009,222Method for forming semiconductor device structure202411,685,015Method and system for performing chemical mechanical polishing202311,673,223Chemical mechanical polishing method202311,292,101Chemical mechanical polishing apparatus and method202211,251,063Article transporter in semiconductor fabrication202211,239,092Method for forming semiconductor device structure2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (8)· patent assignee history
2022–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 8 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 8 | 2022–2025 |