Inventor

Masahiro Ichitani

Inventor

Kodaira, JP

Overview

1991–2009

Patent span

Electricity

Primary field (CPC H)

Patents· 53 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1046%

H05KPrinted circuits20%

H10DInorganic electric semiconductor devices20%

Y10TTechnical subjects covered by former us classification11%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%

PatentTitleYear

7,615,872'Semiconductor device'2009 7,479,705'Semiconductor device'2009 7,286,386'Semiconductor device'2007 7,061,785'Stacked large-scale integrated circuit (LSI) semiconductor device with miniaturization and thinning of package'2006 7,015,069'Method of manufacturing a semiconductor device and a semiconductor device'2006 6,919,622'Semiconductor device'2005 6,887,739'Method of manufacturing semiconductor package including forming a resin sealing member'2005 6,872,597'Method of manufacturing a semiconductor device and a semiconductor device'2005 6,764,878'Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate'2004 6,759,279'Method of manufacturing semiconductor device having resin sealing body'2004 6,723,583'Method of manufacturing a semiconductor device using a mold'2004 6,720,208'Semiconductor device'2004 6,621,160'Semiconductor device and mounting board'2003 6,596,561'Method of manufacturing a semiconductor device using reinforcing patterns for ensuring mechanical strength during manufacture'2003 6,590,275'Ball grid array type semiconductor package having a flexible substrate'2003 6,563,212'Semiconductor device'2003 6,531,760'Semiconductor device'2003 6,512,176'Semiconductor device'2003 6,476,466'Ball grid array type semiconductor package having a flexible substrate'2002 6,448,111'Method of manufacturing a semiconductor device'2002 6,437,428'Ball grid array type semiconductor package having a flexible substrate'2002 6,404,049'Semiconductor device, manufacturing method thereof and mounting board'2002 6,340,793'Semiconductor device'2002 6,326,681'Semiconductor device'2001 6,303,982'Semiconductor device'2001 6,232,650'Semiconductor device having a chip mounted on a flexible substrate with separated insulation layers to prevent short-circuiting'2001 6,204,552'Semiconductor device'2001 6,130,114'Semiconductor device'2000 6,124,629'Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip'2000 6,120,301'Semiconductor device and method of manufacturing the same'2000 6,100,580'Semiconductor device having all outer leads extending from one side of a resin member'2000 6,100,115'Semiconductor device'2000 6,081,023'Semiconductor device'2000 6,072,231'Semiconductor device'2000 6,069,029'Semiconductor device chip on lead and lead on chip manufacturing'2000 6,018,191'Semiconductor device'2000 5,981,315'Semiconductor device'1999 5,914,530'Semiconductor device'1999 5,869,888'Semiconductor device with lead structure on principal surface of chip'1999 5,863,817'Semiconductor device'1999 5,821,606'Semiconductor device'1998 5,793,099'Semiconductor device'1998 5,714,405'Semiconductor device'1998 5,612,569'Semiconductor device'1997 5,583,375'Semiconductor device with lead structure within the planar area of the device'1996 5,571,428'Semiconductor leadframe and its production method and plastic encapsulated semiconductor device'1996 5,530,286'Semiconductor device'1996 5,466,888'Packaged semiconductor device having stress absorbing film'1995 5,437,915'Semiconductor leadframe and its production method and plastic encapsulated semiconductor device'1995 5,406,028'Packaged semiconductor device having stress absorbing film'1995 5,358,904'Semiconductor device'1994 5,252,854'Semiconductor device having stacked lead structure'1993 5,068,712'Semiconductor device'1991

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1991–2003Patents assigned to HITACHI LTD (38)· patent assignee history

1991–2009Based in Kodaira, JP· patent location history

1996–1999Patents assigned to HITACHI MICROCOMPUTER SYST (2)· patent assignee history

2000Based in Koganei, JP· patent location history

2001–2005Patents assigned to HITACHI HOKKAI SEMICONDUCTOR (8)· patent assignee history

2003–2006Patents assigned to HITACHI YONEZAWA ELECTRONICS (4)· patent assignee history

2004–2009Patents assigned to RENESAS TECH CORP (10)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HITACHI LTD	38	1991–2003
RENESAS TECH CORP	10	2004–2009
HITACHI HOKKAI SEMICONDUCTOR	8	2001–2005
HITACHI YONEZAWA ELECTRONICS	4	2003–2006
HITACHI MICROCOMPUTER SYST	2	1996–1999

Locations

Location	Patents	Span
Kodaira, JP	52	1991–2009
Koganei, JP	1	2000