Inventor
Ernest N. Urfer
Inventor
Hopewell Junction, NY, US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits36%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
Y10TTechnical subjects covered by former us classification18%
C04BLime, magnesia9%
PatentTitleYear
4,407,007'Process and structure for minimizing delamination in the fabrication of multi-layer ceramic substrate'19834,336,088'Method of fabricating an improved multi-layer ceramic substrate'19824,302,625'Multi-layer ceramic substrate'19813,956,052'Recessed metallurgy for dielectric substrates'1976Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1976–1983Patents assigned to IBM (4)· patent assignee history
1976–1983Based in Hopewell Junction, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 4 | 1976–1983 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hopewell Junction, New York, US | 4 | 1976–1983 |