Inventor

Kiyoshi Hasegawa

Inventor
Tokyo, JP

Overview

79→
Patents
1976–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 79 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

Y10Tprimary
Y10TTechnical subjects covered by former us classification10%
G01NInvestigating or analysing materials by determining their chemical or physical properties7%
H05KPrinted circuits7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
C23CCoating metallic material4%
H02KDynamo-electric machines4%
H01FMagnets4%
B26FPerforating3%
G06FElectric digital data processing3%
PatentTitleYear
10,968,587Pneumatic fender202110,967,590Tire202110,668,641Magnet cutting device202010,583,579Apparatus and method for manufacturing field-pole magnet202010,279,504Manufacture method and manufacturing device for manufacturing magnet piece constituting magnet body for field pole disposed on rotating electric machine20199,929,628'Magnet insertion method into rotor core'20189,819,250'Magnet inserting apparatus for magnet insertion into magnet insertion slots of rotor core'20179,796,150'Apparatus and method for manufacturing field-pole magnet'20179,779,871'Manufacturing device for cleft magnet'20179,754,719'Cutting method and cutting device of manufacturing magnet piece forming magnet body for field pole to be arranged in rotating electric machine'20179,712,025'Magnet inserting apparatus for magnet insertion into magnet insertion slots of rotor core and method thereof'20179,625,539'Magnet evaluating device and method'20179,562,279'Prespray processing method'20179,488,519'Measuring instrument using light beam'20169,339,046'Frozen fresh cream to be whipped, method for producing the frozen fresh cream, whipped cream, and method for producing the whipped cream'20169,188,553'X-ray fluorescence analyzer'20159,109,276'Cylindrical internal surface processing method'20158,997,341'Substrate for mounting semiconductor chip and method for producing same'2015D0723701'Light shielding sheet of a biological optical measuring instrument'20158,890,460'Servo control device'20148,882,486'Control device for an injection molding machine'20148,815,334'Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board'20148,705,698'X-ray analyzer and mapping method for an X-ray analysis'20148,611,493'X-ray fluorescence analyzer and X-ray fluorescence analysis method'20138,426,742'Connecting terminal, semiconductor package using connecting terminal and method for manufacturing semiconductor package'20138,172,625'Spherical terminal with guide groove'20128,167,653'Shield shell'20127,964,289'Formation method of metal layer on resin layer, printed wiring board, and production method thereof'20117,862,889'Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board'20117,818,877'Formation method of metal layer on resin layer'20107,794,306'Surface finishing apparatus and related method'20107,629,045'Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board'20097,615,277'Formation method of metal layer on resin layer, printed wiring board, and production method thereof'20097,587,025'X-ray analysis apparatus and X-ray analysis method'20097,529,337'Energy dispersion type radiation detecting system and method of measuring content of object element'20097,436,077'Semiconductor device and method of manufacturing the same'20087,413,498'Lapping apparatus and lapping method'20087,153,119'Apparatus for extruding food dough'20067,062,014'X-ray analyzer for analyzing plastics'20067,033,245'Lapping apparatus and lapping method'20066,975,039'Method of forming a ball grid array package'20056,879,188'Semiconductor integrated circuit device'20056,811,828'Electroless gold plating solution and method for electroless plating'20046,746,173'Universal joint'20046,677,219'Method of forming a ball grid array package'20046,622,685'Prespray processed cylinder inside and cylinder inside prespray processing method'20036,624,008'Semiconductor chip installing tape, semiconductor device and a method for fabricating thereof'20036,584,169'X-ray mapping analysis method'20036,580,152'Semiconductor with plural side faces'20036,518,655'Multi-chip package-type semiconductor device'20036,515,519'Semiconductor integrated circuit device'20036,489,824'Timing-control circuit device and clock distribution system'20026,474,863'Agitator and fixing device thereof'20026,404,846'Fluorescent x-ray method for determining x-ray alignment by luminescent changes'20026,300,807'Timing-control circuit device and clock distribution system'20016,300,685'Semiconductor package'20016,166,887'Magnetic head unit, with coil winding arrangement to allow for specific gimbal to head surface dimensions'20006,160,682'Magnetic head device with rail formed within width of head chip and method of making same'20006,115,450'X-ray fluorescence analyzer capable of determining the center of a sample'20005,906,697'Adhesive agent for a vehicular glass and method for mounting the glass onto a vehicle body'19995,895,271'Metal film forming method'19995,849,631'Method of manufacturing semiconductor device'19985,745,232'Apparatus for inspecting deformation of pipe'19985,689,879'Metal foil for printed wiring board and production thereof'19975,653,037'Apparatus and method for measurement of tapped hole'19975,579,879'One-way clutch'19965,553,297'Industrial control apparatus'19965,511,103'Method of X-ray mapping analysis'19965,425,066'Method of finding the center of a band-shaped region'19955,403,672'Metal foil for printed wiring board and production thereof'19955,338,170'Device for charging fillings'19945,309,632'Process for producing printed wiring board'19945,203,216'Supporting apparatus for supporting pinion shaft in rack-pinion power transmitting system'19935,185,777'X-ray radiographing system with spot-film device'19934,767,113'Sheet film feeder'19884,613,803'Industrial robot and a method for positioning same'19864,273,531'Root canal measuring apparatus'19814,194,218'Inspection apparatus for underground channels'19803,959,718'Direct current supply source'1976

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1976–2008Patents assigned to OKI ELECTRIC IND CO LTD (8)· patent assignee history
1976–2015Based in Tokyo, JP· patent location history
1981–2017Patents assigned to HASEGAWA KIYOSHI (14)· patent assignee history
1994–2015Patents assigned to HITACHI CHEMICAL CO LTD (12)· patent assignee history
1994–2014Based in Yuki, JP· patent location history
1995–2003Patents assigned to SEIKO INSTR INC (5)· patent assignee history
1996–2014Based in Chiba, JP· patent location history
1997–2020Patents assigned to NISSAN MOTOR (17)· patent assignee history
2001–2005Based in Fusa, JP· patent location history
2006–2020Based in Yokohama, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
NISSAN MOTOR171997–2020
HASEGAWA KIYOSHIself141981–2017
HITACHI CHEMICAL CO LTD121994–2015
OKI ELECTRIC IND CO LTD81976–2008
SEIKO INSTR INC51995–2003
Locations
LocationPatentsSpan
Tokyo, JP161976–2015
Yokohama, JP132006–2020
Yuki, JP101994–2014
Chiba, JP91996–2014
Fusa, JP42001–2005