Inventor
ALESSANDRO FAES
Inventor
AT
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Lprimary
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure29%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems21%
B81BMicrostructural devices or systems, e.g. micromechanical devices14%
H01LSemiconductor devices7%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers7%
H10DInorganic electric semiconductor devices7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
PatentTitleYear
12,191,402Method of manufacturing a semiconductor transducer device with multilayer diaphragm and semiconductor transducer device with multilayer diaphragm202511,946,822Semiconductor transducer device with multilayer diaphragm and method of manufacturing a semiconductor transducer device with multilayer diaphragm202411,585,711Capacitive pressure with Ti electrode202311,572,271Method for manufacturing an etch stop layer and MEMS sensor comprising an etch stop layer202311,248,976Capacitive pressure sensors and other devices having a suspended membrane and having rounded corners at an anchor edge2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to SCIOSENSE BV (4)· patent assignee history
2022–2025Based in AT· patent location history
2023Patents assigned to AMS AG (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SCIOSENSE BV | 4 | 2022–2025 |
| AMS AG | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| AT | 5 | 2022–2025 |