Inventor
Tomomi Okumura
Inventor
Kariya, JP
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1041%
H01LSemiconductor devices33%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds4%
H10DInorganic electric semiconductor devices4%
B23KSoldering or unsoldering2%
C23CCoating metallic material2%
C25DProcesses for the electrolytic or electrophoretic production of coatings2%
G01NInvestigating or analysing materials by determining their chemical or physical properties2%
H01RElectrically-conductive connections2%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems2%
PatentTitleYear
10,304,777Semiconductor device having a plurality of semiconductor modules connected by a connection component201910,283,429Semiconductor device201910,157,815Semiconductor device201810,103,090Semiconductor device201810,026,673Semiconductor device and power module20189,960,096Semiconductor device20189,831,160Semiconductor device20179,711,884'Terminal connection structure and semiconductor apparatus'20179,406,593'Lead frame, electric power converting device, semiconductor apparatus and method of manufacturing semiconductor apparatus'20169,331,001'Semiconductor module'20169,312,211'Semiconductor device and manufacturing method thereof'20169,236,330'Power module'20169,224,662'Semiconductor apparatus'20159,059,145'Power module, method for manufacturing power module, and molding die'20159,006,784'Semiconductor device and manufacturing method thereof'20158,994,167'Semiconductor device'20158,884,411'Semiconductor device and manufacturing method thereof'20148,810,026'Semiconductor module'20148,742,556'Semiconductor module'20147,800,230'Solder preform and electronic component'20107,235,876'Semiconductor device having metallic plate with groove'20076,531,568'Polyimide containing crosslinkable group and process for producing the same'20036,458,912'Crystalline polyimide for melt molding with satisfactory thermal stability'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2003Based in Kanagawa, JP· patent location history
2007–2019Patents assigned to DENSO CORP (14)· patent assignee history
2014–2019Patents assigned to TOYOTA MOTOR CO LTD (18)· patent assignee history
2014–2016Patents assigned to KADOGUCHI TAKUYA (10)· patent assignee history
2014–2016Patents assigned to OKUMURA TOMOMI (10)· patent assignee history
2014–2016Patents assigned to KAWASHIMA TAKANORI (5)· patent assignee history
2014–2016Based in Toyota, JP· patent location history
2015–2017Based in Chiryu, JP· patent location history
2015–2016Based in Anjo, JP· patent location history
2017–2019Based in Kariya, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOYOTA MOTOR CO LTD | 18 | 2014–2019 |
| DENSO CORP | 14 | 2007–2019 |
| KADOGUCHI TAKUYA | 10 | 2014–2016 |
| OKUMURA TOMOMIself | 10 | 2014–2016 |
| KAWASHIMA TAKANORI | 5 | 2014–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kariya, JP | 7 | 2017–2019 |
| Toyota, JP | 5 | 2014–2016 |
| Chiryu, JP | 4 | 2015–2017 |
| Anjo, JP | 3 | 2015–2016 |
| Kanagawa, JP | 2 | 2002–2003 |