Inventor
Jeffrey S. LEIB
Inventor
US
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices21%
H10DInorganic electric semiconductor devices21%
H10BElectronic memory devices19%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
PatentTitleYear
12,255,247Trench contact structures for advanced integrated circuit structure fabrication202512,225,740Dual metal silicide structures for advanced integrated circuit structure fabrication202512,051,698Fabrication of gate-all-around integrated circuit structures having molybdenum nitride metal gates and gate dielectrics with a dipole layer202411,961,767Dual metal silicide structures for advanced integrated circuit structure fabrication202411,955,532Dual metal gate structure having portions of metal gate layers in contact with a gate dielectric202411,948,997Trench contact structures for advanced integrated circuit structure fabrication202411,664,439Trench contact structures for advanced integrated circuit structure fabrication202311,508,626Dual metal silicide structures for advanced integrated circuit structure fabrication202211,482,611Replacement gate structures for advanced integrated circuit structure fabrication202211,342,445Differentiated voltage threshold metal gate structures for advanced integrated circuit structure fabrication2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to INTEL CORP (10)· patent assignee history
2022–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 10 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 10 | 2022–2025 |