Inventor
Yves Martin
Inventor
Ossining, NY, US
Overview
Patents· 120 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution8%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation7%
H01LSemiconductor devices7%
B82YSpecific uses or applications of nanostructures7%
G02BOptical elements, systems or apparatus5%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
G11BInformation storage based on relative movement between record carrier and transducer4%
Y10TTechnical subjects covered by former us classification4%
F24SSolar heat collectors3%
PatentTitleYear
10,935,533Method of assembling a fugitive gas sensor enclosure202110,901,146Single edge coupling of chips with integrated waveguides202110,901,147Single edge coupling of chips with integrated waveguides202110,733,650Method and a system for providing product information to media displaying devices202010,613,023Housing apparatus for sensitive gas sensor202010,562,242Method and apparatus for application of thermosetting tape on surfaces202010,527,787Single edge coupling of chips with integrated waveguides202010,490,971Self-alignment features for III-V ridge process and angled facet die201910,444,429Single edge coupling of chips with integrated waveguides201910,431,705Cooling system for high performance solar concentrators201910,393,962Optimized stand-offs and mechanical stops for precise three dimensional self-alignment201910,302,859Single edge coupling of chips with integrated waveguides201910,031,713Method and a system for displaying product information on electronic labels201810,014,274Optimized solder pads for microelectronic components20189,897,537'Gas sensor with integrated optics and reference cell'20189,887,146'Method and apparatus for chip cooling'20189,869,831'Optimized solder pads for solder induced alignment of opto-electronic chips'20189,847,751Techniques for optimizing photo-voltaic power via inductive coupling20179,806,206'Optimized grid design for concentrator solar cell'20179,683,690'Movement-constraining assembly for fluid-conveying system'20179,625,379'Gas sensor with integrated optics and reference cell'20179,606,308'Three dimensional self-alignment of flip chip assembly using solder surface tension during solder reflow'20179,562,852'Gas sensor with integrated optics and reference cell'20179,543,736'Optimized solder pads for solder induced alignment of opto-electronic chips'20179,496,422'Multi-element packaging of concentrator photovoltaic cells'20169,466,590'Optimized solder pads for microelectronic components'20169,412,891'Thermal receiver for high power solar concentrators and method of assembly'20169,406,009'Method and apparatus to tag metal'20169,406,817'Lead frame package for solar concentrators'20169,390,356'Method and apparatus to tag metal'20169,377,251'Thermal ground plane for cooling a computer'20169,324,896'Thermal receiver for high power solar concentrators and method of assembly'20169,318,636'Secondary optic for concentrating photovoltaic device'20169,310,138'Cooling system for high performance solar concentrators'20169,231,139'Structure and design of concentrator solar cell assembly receiver substrate'20169,178,466'Transportable photovoltaic system'20159,178,467'Transportable photovoltaic system'20159,157,657'Method of cooling a solar concentrator'20159,127,859'Multi-point cooling system for a solar concentrator'20159,057,539'Method of tracking and collecting solar energy'20158,964,375'Techniques for data center cooling'20158,944,151'Method and apparatus for chip cooling'20158,941,000'Solar concentrator cooling by vortex gas circulation'20158,791,355'Homogenizing light-pipe for solar concentrators'20148,776,868'Thermal ground plane for cooling a computer'20148,721,952'Pneumatic method and apparatus for nano imprint lithography having a conforming mask'20148,684,680'Sealing and cooling at the joint between shroud segments'20148,669,466'Grid-line-free contact for a photovoltaic cell'20148,662,824'Rotor containment structure for gas turbine engine'20148,649,242'Insonification device that includes a three-dimensional network of emitters arranged in at least two concentric spirals, which are designed to generate a beam of high-intensity focussed waves'20148,636,369'Prevention and remediation of damage to optical surfaces'20148,596,655'Parts securing mechanism and method thereof'20138,593,815'Techniques for data center cooling'20138,574,946'Multi-element packaging of concentrator photovoltaic cells'20138,569,616'Method of concetrating solar energy'20138,490,619'Solar energy alignment and collection system'20138,465,164'Mirror assembly including foam encompassed within a polymer matrix'20138,459,334'Containment for a patterned metal thermal interface'20138,455,998'Method and package for circuit chip packaging'20138,373,758'Techniques for analyzing performance of solar panels and solar cells using infrared diagnostics'20138,310,132'Insonification device having an internal cooling chamber'20128,240,985'Shroud segment arrangement for gas turbine engines'20128,156,998'Patterned metal thermal interface'20128,137,997'Method and system for tone inverting of residual layer tolerant imprint lithography'20128,137,996'Method and system for tone inverting of residual layer tolerant imprint lithography'20128,115,097'Grid-line-free contact for a photovoltaic cell'20128,091,614'Air/fluid cooling system'20128,053,284'Method and package for circuit chip packaging'20118,043,218'Therapeutic endocavity probe comprising an image transducer integrated within the therapy ultrasonic transducer'20118,037,926'Method and apparatus for chip cooling'20118,026,439'Solar concentration system'20118,012,309'Method of making wet embossed paperboard'20118,009,430'Techniques for data center cooling'20117,952,193'Method and apparatus for deploying a liquid metal thermal interface for chip cooling'20117,907,410'Universal patterned metal thermal interface'20117,898,076'Structure and methods of processing for solder thermal interface materials for chip cooling'20117,883,832'Method and apparatus for direct referencing of top surface of workpiece during imprint lithography'20117,804,048'Structure for cooling a surface'20107,776,709'Cut-and-paste imprint lithographic mold and method therefor'20107,776,628'Method and system for tone inverting of residual layer tolerant imprint lithography'20107,738,207'Optical storage system using an antenna for recording information data to a phase-change type medium'20107,697,291'Active liquid metal thermal spreader'20107,694,719'Patterned metal thermal interface'20107,503,728'Stabilized floating support'20097,482,197'Method and apparatus for deploying a liquid metal thermal interface for chip cooling'20097,469,039'Device and method for generating an x-ray point source by geometric confinement'20087,440,281'Thermal interface apparatus'20087,344,955'Cut-and-paste imprint lithographic mold and method therefor'20087,288,840'Structure for cooling a surface'20077,280,297'Optical storage system using an antenna for recording information data to a phase-change type medium'20077,265,977'Active liquid metal thermal spreader'20077,262,936'Heating device and magnetic recording head for thermally-assisted recording'20077,219,713'Heterogeneous thermal interface for cooling'20077,186,977'Method for non-destructive trench depth measurement using electron beam source and X-ray detection'20077,160,259'Fluid manipulating system for therapy apparatus'20077,130,379'Device and method for generating an x-ray point source by geometric confinement'20067,063,127'Method and apparatus for chip-cooling'20066,920,088'Assembly for writing and/or erasing high density data on a media'20056,771,445'Assembly and method suitable for thermo-magnetic writing/reading of data'20046,757,235'Assembly suitable for reading data based on thermal coupling'20046,702,186'Assembly comprising a plurality of media probes for writing/reading high density magnetic data'20046,597,639'Assembly suitable for writing high density data on a ferroelectric media'20036,532,125'Apparatus and method suitable for magnetic-thermal recording'20036,510,120'Method for writing and/or erasing high density data on a media'20036,433,310'Assembly suitable for reading/writing/erasing information on a media based on thermal coupling'20026,233,206'High density magnetic thermal recording and reproducing assembly'20016,169,281'Apparatus and method for determining side wall profiles using a scanning probe microscope having a probe dithered in lateral directions'20015,646,731'Interferometric detecting/imaging method based on multi-pole sensing'19975,623,338'Interferometric near-field apparatus based on multi-pole sensing'19975,578,745'Calibration standards for profilometers and methods of producing them'19965,382,795'Ultrafine silicon tips for AFM/STM profilometry'19955,360,974'Dual quad flexure scanner'19945,347,854'Two dimensional profiling with a contact force atomic force microscope'19945,283,442'Surface profiling using scanning force microscopy'19945,262,643'Automatic tip approach method and apparatus for scanning probe microscope'19935,260,098'Method and apparatus for tinning tinnable areas on an electronic component package'19935,242,541'Method of producing ultrafine silicon tips for the AFM/STM profilometry'19935,003,815'Atomic photo-absorption force microscope'19914,155,674'Offshore platforms'19793,962,064'Electrolyzer and a method for the production of readily oxydizable metals in a state of high purity'1976Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1979–2020Based in Paris, FR· patent location history
1991–2021Patents assigned to IBM (97)· patent assignee history
1993–2021Based in Ossining, NY, US· patent location history
2011–2016Based in Yorktown Heights, NY, US· patent location history
2011–2014Based in Beynost, FR· patent location history
2012–2016Patents assigned to MARTIN YVES C (23)· patent assignee history
2012–2016Patents assigned to VAN KESSEL THEODORE G (22)· patent assignee history
2012–2016Patents assigned to SANDSTROM ROBERT L (13)· patent assignee history
2012–2014Patents assigned to MARTIN YVES (11)· patent assignee history
2012–2014Based in Boucherville, CA· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 97 | 1991–2021 |
| MARTIN YVES Cself | 23 | 2012–2016 |
| VAN KESSEL THEODORE G | 22 | 2012–2016 |
| SANDSTROM ROBERT L | 13 | 2012–2016 |
| MARTIN YVESself | 11 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ossining, New York, US | 86 | 1993–2021 |
| Yorktown Heights, New York, US | 13 | 2011–2016 |
| Paris, FR | 3 | 1979–2020 |
| Boucherville, CA | 3 | 2012–2014 |
| Beynost, FR | 3 | 2011–2014 |