Inventor
John Saunders Corbin, Jr.
Inventor
Austin, TX, US
Overview
Patents· 43 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits23%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
G01RMeasuring electric variables19%
Y10TTechnical subjects covered by former us classification13%
B23KSoldering or unsoldering4%
H01RElectrically-conductive connections4%
Y02PClimate change mitigation technologies in the production or processing of goods4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
H02BBoards, substations or switching arrangements for the supply or distribution of electric power3%
F16MFrames, casings or beds of engines, machines or apparatus, not specific to engines, machines or apparatus provided for elsewhere1%
PatentTitleYear
8,421,217'Achieving mechanical and thermal stability in a multi-chip package'20138,202,765'Achieving mechanical and thermal stability in a multi-chip package'20127,975,379'Method of making a land-grid-array (LGA) interposer'20117,777,329'Heatsink apparatus for applying a specified compressive force to an integrated circuit device'20107,701,720'Electronic assembly and techniques for installing a heatsink in an electronic assembly'20107,687,894'IC chip package having automated tolerance compensation'20107,479,796'Functional and stress testing of LGA devices'20097,466,155'Functional and stress testing of LGA devices'20087,463,017'Functional and stress testing of LGA devices'20087,456,644'Functional and stress testing of LGA devices'20087,453,279'Functional and stress testing of LGA devices'20087,425,822'Functional and stress testing of LGA devices'20087,423,440'Functional and stress testing of LGA devices'20087,405,583'Functional and stress testing of LGA devices'20087,352,200'Functional and stress testing of LGA devices'20087,345,881'Non-influencing fastener for mounting a heat sink in contact with an electronic component'20087,135,877'Temperature and condensation control system for functional tester'20067,119,433'Packaging for enhanced thermal and structural performance of electronic chip modules'20066,921,272'Method and apparatus for providing positive contact force in an electrical assembly'20056,911,836'Apparatus for functional and stress testing of exposed chip land grid array devices'20056,802,733'Topside installation apparatus for land grid array modules'20046,792,375'Apparatus, system, and method of determining loading characteristics on an integrated circuit module'20046,765,397'Apparatus and method for testing land grid array modules'20046,757,965'Method of installing a land grid array multi-chip modules'20046,634,095'Apparatus for mounting a land grid array module'20036,511,282'Modular and flexible service frame enclosure'20036,504,105'Solder ball connections and assembly process'20036,497,465'Anti-tilt mechanism for a drawer assembly'20026,475,011'Land grid array socket actuation hardware for MCM applications'20026,449,162'Removable land grid array cooling solution'20026,449,155'Land grid array subassembly for multichip modules'20026,425,648'Modular and flexible server frame enclosure'20026,425,488'Integrated flexible frame tie down retention system for raised and non-raised floor applications'20026,385,044'Heat pipe heat sink assembly for cooling semiconductor chips'20026,278,615'Heatsink grounding spring and shield apparatus'20016,229,708'Multi-axis microprocess or docking mechanism'20016,180,874'High density heatsink attachment and method therefor'20016,024,330'Uni-axial floor anchor and leveler for racks'20005,738,531'Self-alligning low profile socket for connecting ball grid array devices through a dendritic interposer'19985,713,690'Apparatus for attaching heatsinks'19985,675,889'Solder ball connections and assembly process'19975,591,941'Solder ball interconnected assembly'19974,589,790'Method and apparatus for controlling escapement'1986Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1986–2013Patents assigned to IBM (43)· patent assignee history
1986–2013Based in Austin, TX, US· patent location history
2012–2013Patents assigned to CASEY JON A (2)· patent assignee history
2012–2013Patents assigned to CORBIN JR JOHN S (2)· patent assignee history
2012–2013Patents assigned to DANOVITCH DAVID (2)· patent assignee history
2012–2013Patents assigned to DEPATIE ISABELLE (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 43 | 1986–2013 |
| CASEY JON A | 2 | 2012–2013 |
| CORBIN JR JOHN Sself | 2 | 2012–2013 |
| DANOVITCH DAVID | 2 | 2012–2013 |
| DEPATIE ISABELLE | 2 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Austin, Texas, US | 43 | 1986–2013 |