Inventor
Thomas E. Lombardi
Inventor
Poughkeepsie, NY, US
Overview
Patents· 30 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H01LSemiconductor devices14%
H05KPrinted circuits14%
Y10TTechnical subjects covered by former us classification11%
Y02PClimate change mitigation technologies in the production or processing of goods7%
B23KSoldering or unsoldering5%
H01RElectrically-conductive connections5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
G01RMeasuring electric variables3%
G02BOptical elements, systems or apparatus3%
PatentTitleYear
10,985,129Mitigating cracking within integrated circuit (IC) device carrier202110,832,987Managing thermal warpage of a laminate202010,750,615Method and apparatus for strain relieving surface mount attached connectors202010,368,441Method and apparatus for strain relieving surface mount attached connectors201910,014,273Fixture to constrain laminate and method of assembly20189,974,179Method and apparatus for strain relieving surface mount attached connectors20189,798,088'Barrier structures for underfill blockout regions'20179,673,177'Selectively soluble standoffs for chip joining'20179,627,784'Method and apparatus for strain relieving surface mount attached connectors'20179,543,253'Method for shaping a laminate substrate'20179,455,234'Fixture to constrain laminate and method of assembly'20169,433,105'Method of fabricating printed circuit boards'20169,293,439'Electronic module assembly with patterned adhesive array'20169,093,563'Electronic module assembly with patterned adhesive array'20159,059,240'Fixture for shaping a laminate substrate'20159,048,245'Method for shaping a laminate substrate'20158,759,151'Fixture to constrain laminate and method of assembly'20148,492,910'Underfill method and chip package'20138,367,543'Structure and method to improve current-carrying capabilities of C4 joints'20138,304,290'Overcoming laminate warpage and misalignment in flip-chip packages'20128,188,597'Fixture to constrain laminate and method of assembly'20128,129,230'Underfill method and chip package'20126,762,119'Method of preventing solder wetting in an optical device using diffusion of Cr'20046,528,352'Use of conductive adhesive to form temporary electrical connections for use in TCA (temporary chip attach) applications'20036,518,674'Temporary attach article and method for temporary attach of devices to a substrate'20036,376,054'Surface metallization structure for multiple chip test and burn-in'20026,303,400'Temporary attach article and method for temporary attach of devices to a substrate'20015,643,818'Removal of residues from metallic insert used in manufacture of multi-layer ceramic substrate with cavity for microelectronic chip'19975,489,465'Edge seal technology for low dielectric/porous substrate processing'19965,480,503'Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996–2021Patents assigned to IBM (26)· patent assignee history
1996Based in Wappingers Falls, NY, US· patent location history
1997–2021Based in Poughkeepsie, NY, US· patent location history
2012–2015Patents assigned to LOMBARDI THOMAS E (8)· patent assignee history
2012–2013Patents assigned to GAYNES MICHAEL A (2)· patent assignee history
2012–2013Patents assigned to KUMAR RAJNEESH (2)· patent assignee history
2012–2013Based in Hopewell Junction, NY, US· patent location history
2012Based in Research Triangle Park, NC, US· patent location history
2016–2017Patents assigned to GLOBALFOUNDRIES INC (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 26 | 1996–2021 |
| LOMBARDI THOMAS Eself | 8 | 2012–2015 |
| GLOBALFOUNDRIES INC | 3 | 2016–2017 |
| GAYNES MICHAEL A | 2 | 2012–2013 |
| KUMAR RAJNEESH | 2 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Poughkeepsie, New York, US | 25 | 1997–2021 |
| Hopewell Junction, New York, US | 2 | 2012–2013 |
| Wappingers Falls, New York, US | 2 | 1996 |
| Research Triangle Park, NC, US | 1 | 2012 |