Inventor
YASUHIRO HIDAKA
Inventor
JP
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Nprimary
G01NInvestigating or analysing materials by determining their chemical or physical properties21%
B29CShaping or joining of plastics15%
G02BOptical elements, systems or apparatus15%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light10%
G01BMeasuring length, thickness or similar linear dimensions8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices6%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts4%
B29LIndexing scheme associated with subclass b29c, relating to particular articles4%
H01LSemiconductor devices4%
PatentTitleYear
12,510,491Apparatus for inspecting surface of object202512,485,598Operation abnormality detection method, method for manufacturing resin container, operation abnormality detection device, device for manufacturing resin container, and device for manufacturing resin preform202512,345,626Ellipsometer and apparatus for inspecting semiconductor device including the ellipsometer202512,339,223Measuring apparatus and testing apparatus having the same202512,337,517Mold opening/closing device and method for controlling mold opening/closing device202512,318,990Resin container manufacturing device and manufacturing method202512,228,499Pupil ellipsometry measurement apparatus and method and method of fabricating semiconductor device using the pupil ellipsometry measurement method202512,076,900Resin molded article manufacturing device, and manufacturing device control method202411,958,231Resin container manufacturing device and manufacturing method202411,885,608Ellipsometer and inspection device for inspecting semiconductor device having the same202411,761,906Optical device202311,604,136Pupil ellipsometry measurement apparatus and method and method of fabricating semiconductor device using the pupil ellipsometry measurement method202311,493,322Ellipsometer202211,478,974Blow molding machine and method for controlling blow molding machine202211,385,764Blow molding device and interface device provided in blow molding device202211,314,073Lighting device and inspection apparatus having the same202211,193,882Ellipsometer and inspection device for semiconductor device2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to SAMSUNG ELECTRONICS CO LTD (10)· patent assignee history
2021–2025Based in JP· patent location history
2022–2025Patents assigned to NISSEI ASB MACHINE CO LTD (7)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 10 | 2021–2025 |
| NISSEI ASB MACHINE CO LTD | 7 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 17 | 2021–2025 |