Inventor
JERRY M. CHOW
Inventor
US
Overview
Patents· 31 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Nprimary
G06NComputing arrangements based on specific computational models18%
H10NElectric solid-state devices not otherwise provided for16%
H01LSemiconductor devices12%
H01PWaveguides7%
F25DRefrigerators6%
F25BRefrigeration machines, plants or systems6%
B82YSpecific uses or applications of nanostructures5%
F17CVessels for containing or storing compressed, liquefied or solidified gases5%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
G06FElectric digital data processing3%
PatentTitleYear
D1114790Computer assembly housing202612,517,856Modular quantum system with discrete levels of connectivity2026D1090525Computer assembly housing202512,305,814Custom thermal shields for cryogenic environments2025D1063146Computer assembly housing202512,232,427Superconducting qubit capacitance and frequency of operation tuning202512,219,737Cryogenic packaging for thermalization of low temperature devices202512,137,619Reducing qubit frequency collisions through lattice design202412,117,130Transfer port system for cryogenic environments202411,984,890Scalable interconnected quantum architecture202411,971,141Low thermal conductivity support system for cryogenic environments202411,804,641Reduced thermal resistance attenuator on high-thermal conductivity substrates for quantum applications202311,802,663Multiple cryogenic systems sectioned within a common vacuum space202311,788,6851 kelvin and 300 millikelvin thermal stages for cryogenic environments202311,754,323Asynchronous drive of cryocooling systems for low temperature applications202311,621,466Well thermalized stripline formation for high-density connections in quantum applications202311,621,467Well thermalized microstrip formation for flexible cryogenic microwave lines in quantum applications202311,581,474Electrical leads for trenched qubits202311,552,236Superconducting qubit capacitance and frequency of operation tuning202311,489,103Fabricating transmon qubit flip-chip structures for quantum computing devices202211,443,222Cross-resonance fan-out for efficiency and hardware reduction202211,443,223Transmon qubit flip-chip structures for quantum computing devices202211,424,522Reduced thermal resistance attenuator on high-thermal conductivity substrates for quantum applications202211,349,060Dielectric holder for quantum devices202211,329,356Cryogenic-stripline microwave attenuator202211,289,637Transmon qubits with trenched capacitor structures202211,244,241Quantum device facilitating a cross-resonance operation in a dispersive regime202211,227,229Transmon qubit flip-chip structures for quantum computing devices202211,195,773Flip chip assembly of quantum computing devices202111,189,435Switch device facilitating frequency shift of a resonator in a quantum device202111,165,009Reducing qubit frequency collisions through lattice design2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to IBM (31)· patent assignee history
2021–2026Based in US· patent location history
2025Patents assigned to INT BUSINESS MACHINES ORGANIZATION (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 31 | 2021–2026 |
| INT BUSINESS MACHINES ORGANIZATION | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 31 | 2021–2026 |