Inventor
Jia Li
Inventor
Jen Te Hsiang, TW
Overview
Patents· 51 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
F28Dprimary
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
A61FFilters implantable into blood vessels5%
H10DInorganic electric semiconductor devices5%
A61BDiagnosis4%
Y10TTechnical subjects covered by former us classification4%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering4%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application4%
F04CRotary-piston, or oscillating-piston, positive-displacement machines for liquids3%
G06FElectric digital data processing3%
PatentTitleYear
10,443,943Apparatus and method to control properties of fluid discharge via refrigerative exhaust201910,350,074Patient-specific manufacturing of porous metal prostheses201910,325,065Method and system for creating patient-specific instrumentation for chondral graft transfer201910,231,741Reamer handle coupling201910,226,294Hybrid straight cup impactor20199,892,940'Spray assembly and wet etching device having the same'20189,852,492Face detection20179,788,975'Method of estimating soft tissue balance for knee arthroplasty'20179,775,711'Rapid manufacturing of porous metal prostheses'20179,771,663'Anodization sealing process for an aluminum or aluminum alloy element for vehicles'20179,676,661'Etching method of glass substrate and wet etching apparatus thereof'20179,662,214'Patient-specific manufacturing of porous metal prostheses'20179,522,844'Low temperature poly-silicon thin film preparation apparatus and method for preparing the same'20169,474,165'Substrate delivery device and strong acid or strong base etching adequate for wet process'20169,462,967'Condyle axis locator'20169,267,293'Hand railings'20169,186,154'Patient-specific instruments for total ankle arthroplasty'20159,135,930'Method for fabricating a magnetic write pole using vacuum deposition'20159,078,321'Light emitting system with light emitting power stabilization'20158,992,825'Rapid manufacturing of porous metal prostheses'20158,459,079'Auto-scraping apparatus'20137,654,310'Loop heat pipe'20107,650,932'Loop heat pipe'20107,538,298'Gas removing apparatus for heat pipe'20097,494,249'Multiple-set heat-dissipating structure for LED lamp'20097,493,693'Method for fabricating multi-layer wick structure of heat pipe'20097,494,248'Heat-dissipating structure for LED lamp'20097,467,465'Flexible production process for fabricating heat pipes'20087,467,878'Heat-dissipating structure having multiple heat pipes for LED lamp'20087,430,803'Gas removing apparatus for removing non-condensate gas from a heat pipe and method for the same'20087,404,255'Apparatus and method for removing non-condensing gas in heat pipe'20087,367,383'Multi-layer wick structure of heat pipe'20087,347,250'Loop heat pipe'20087,317,616'Mechanism for connecting loop heat pipe and method therefor'20087,235,460'Method of forming active and isolation areas with split active patterning'20077,225,861'Bubble cycling heat exchanger'20077,143,817'Support structure of heat-pipe multi-layer wick structure'20066,789,611'Bubble cycling heat exchanger'20046,478,082'Heat dissipating apparatus with nest wind duct'20026,444,553'Junction formation with diffusion barrier for silicide contacts and method for forming'20026,439,298'Cylindrical heat radiator'20026,315,033'Heat dissipating conduit'20016,293,332'Structure of a super-thin heat plate'20016,276,444'Protecting device for sealing openings of heat tube and method for manufacturing the same'20016,184,103'High resistance polysilicon SRAM load elements and methods of fabricating therefor'20015,926,701'Thin film transistor fabrication technique'19995,923,964'Nitride encapsulated thin film transistor fabrication technique'19995,909,152'Low power CMOS crystal oscillator circuit'19995,627,103'Method of thin film transistor formation with split polysilicon deposition'19975,616,933'Nitride encapsulated thin film transistor fabrication technique'19975,585,302'Formation of polysilicon resistors in the tungsten strapped source/drain/gate process'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996–2001Patents assigned to SONY ELECTRONICS INC (6)· patent assignee history
1996–2001Patents assigned to SONY CORP (5)· patent assignee history
1996–2001Based in San Antonio, TX, US· patent location history
2001–2009Based in Jen Te Hsiang, TW· patent location history
2001–2009Based in Hsin Chu Hsien, TW· patent location history
2006–2016Patents assigned to LI JIA-HAO (10)· patent assignee history
2008–2010Patents assigned to JAFFE LTD (7)· patent assignee history
2008–2010Based in Jhubei City, TW· patent location history
2015–2019Patents assigned to ZIMMER INC (8)· patent assignee history
2015–2019Based in Warsaw, IN, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LI JIA-HAOself | 10 | 2006–2016 |
| ZIMMER INC | 8 | 2015–2019 |
| JAFFE LTD | 7 | 2008–2010 |
| SONY ELECTRONICS INC | 6 | 1996–2001 |
| SONY CORP | 5 | 1996–2001 |
Locations
| Location | Patents | Span |
|---|---|---|
| Jen Te Hsiang, TW | 9 | 2001–2009 |
| Warsaw, IN, US | 6 | 2015–2019 |
| Hsin Chu Hsien, TW | 6 | 2001–2009 |
| San Antonio, Texas, US | 6 | 1996–2001 |
| Jhubei City, TW | 5 | 2008–2010 |