Inventor
EUNGNAK HAN
Inventor
US
Overview
Patents· 25 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices27%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
H10DInorganic electric semiconductor devices11%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices9%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds4%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry1%
B05DProcesses for applying fluent materials to surfaces, in general1%
B82YSpecific uses or applications of nanostructures1%
C07FAcyclic, carbocyclic or heterocyclic compounds containing elements other than carbon, hydrogen, halogen, oxygen, nitrogen, sulfur, selenium or tellurium1%
PatentTitleYear
12,581,927Contact over active gate structures with conductive trench contact taps for advanced integrated circuit structure fabrication202612,506,032—202512,400,913Contact over active gate structures with conductive trench contact taps for advanced integrated circuit structure fabrication202512,293,913Directed self-assembly enabled subtractive metal patterning202512,266,527Directed self-assembly enabled patterning over metal layers using assisting features202512,237,223Contact over active gate structures using directed self-assembly for advanced integrated circuit structure fabrication202512,230,536Self-assembled guided hole and via patterning over grating202512,131,991Self aligned gratings for tight pitch interconnects and methods of fabrication202412,087,836Contact over active gate structures with metal oxide-caped contacts to inhibit shorting202412,087,594Colored gratings in microelectronic structures202412,037,434Chemical compositions and methods of patterning microelectronic device structures202412,036,578Interconnect structure surface modifications by passivating agents202412,012,473Directed self-assembly structures and techniques202412,002,678Gate spacing in integrated circuit structures202411,953,826Lined photobucket structure for back end of line (BEOL) interconnect formation202411,846,883Chain scission photoresists and methods for forming chain scission photoresists202311,837,644Contact over active gate structures with metal oxide-caped contacts to inhibit shorting202311,664,305Staggered lines for interconnect performance improvement and processes for forming such202311,605,623Materials and layout design options for DSA on transition regions over active die202311,417,567Conductive cap-based approaches for conductive via fabrication and structures resulting therefrom202211,404,482Self-aligned repeatedly stackable 3D vertical RRAM202211,398,428Multifunctional molecules for selective polymer formation on conductive surfaces and structures resulting therefrom202211,262,654Chain scission resist compositions for EUV lithography applications202211,251,117Self aligned gratings for tight pitch interconnects and methods of fabrication202211,137,681Lined photobucket structure for back end of line (BEOL) interconnect formation2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to INTEL CORP (25)· patent assignee history
2021–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 25 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 25 | 2021–2026 |