Inventor
Tetsuya Kosugi
Inventor
Toyama, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices18%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1018%
F27BFurnaces, kilns, ovens or retorts in general9%
F27DDetails or accessories of furnaces, kilns, ovens or retorts, in so far as they are of kinds occurring in more than one kind of furnace9%
G01KMeasuring temperature9%
H10BElectronic memory devices9%
H10DInorganic electric semiconductor devices9%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
LOC139%
PatentTitleYear
11,049,742Substrate processing apparatus, method of manufacturing semiconductor device, and thermocouple support202111,043,402Cooling unit, heat insulating structure, and substrate processing apparatus2021D0918848Retainer of ceiling heater for semiconductor fabrication apparatus20216,815,747'Semiconductor device comprising capacitor'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004Patents assigned to RENESAS TECH CORP (1)· patent assignee history
2004Based in Hyogo, JP· patent location history
2021Patents assigned to KOKUSAI ELECTRIC CORP (3)· patent assignee history
2021Based in Toyama, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| KOKUSAI ELECTRIC CORP | 3 | 2021 |
| RENESAS TECH CORP | 1 | 2004 |
Locations
| Location | Patents | Span |
|---|---|---|
| Toyama, JP | 3 | 2021 |
| Hyogo, JP | 1 | 2004 |