Inventor
John F. McMahon
Inventor
Phoenix, AZ, US
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%
H05KPrinted circuits20%
LOCD214%
Y10TTechnical subjects covered by former us classification8%
Y02PClimate change mitigation technologies in the production or processing of goods6%
B23KSoldering or unsoldering4%
G06FElectric digital data processing4%
H01RElectrically-conductive connections4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering2%
PatentTitleYear
6,890,798'Stacked chip packaging'20056,208,527'Retention mechanism assembly for processor cartridges with captured screw fasteners'20016,173,489'Organic substrate (PCB) slip plane \"stress deflector\" for flip chip devices'20016,075,712'Flip-chip having electrical contact pads on the backside of the chip'20005,903,432'Computer package with a polygonal shaped motherboard'19995,892,275'High performance power and ground edge connect IC package'19995,811,880'Design for mounting discrete components inside an integrated circuit package for frequency governing of microprocessors'19985,808,875'Integrated circuit solder-rack interconnect module'19985,804,771'Organic substrate (PCB) slip plane \"stress deflector\" for flip chip deivces'19985,777,345'Multi-chip integrated circuit package'19985,734,555'Shared socket multi-chip module and/or piggyback pin grid array package'19985,671,121'Kangaroo multi-package interconnection concept'19975,662,262'Tape withh solder forms and methods for transferring solder forms to chip assemblies'19975,497,938'Tape with solder forms and methods for transferring solder to chip assemblies'19965,476,401'Compact water jet propulsion system for a marine vehicle'19955,375,041'Ra-tab array bump tab tape based I.C. package'19945,362,656'Method of making an electronic assembly having a flexible circuit wrapped around a substrate'19945,321,583'Electrically conductive interposer and array package concept for interconnecting to a circuit board'19945,307,240'Chiplid, multichip semiconductor package design concept'1994D0256816'Toy glider'1980D0244953'Toy wheeled figure'1977D0244952'Toy wheeled figure'1977D0244955'Toy wheeled figure'1977D0244950'Toy wheeled figure'1977D0244954'Toy wheeled figure'1977D0244951'Toy wheeled figure'1977Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1977Patents assigned to GEN MILLS FUN GROUP INC (6)· patent assignee history
1977–1980Based in Boxford, MA, US· patent location history
1980Patents assigned to CPG PROD CORP (1)· patent assignee history
1994–2005Patents assigned to INTEL CORP (17)· patent assignee history
1994–2005Based in Phoenix, AZ, US· patent location history
1995Patents assigned to US ARMY (1)· patent assignee history
1995Based in Rockville, MD, US· patent location history
1999Patents assigned to INTEL CORPORTATION (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 17 | 1994–2005 |
| GEN MILLS FUN GROUP INC | 6 | 1977 |
| CPG PROD CORP | 1 | 1980 |
| INTEL CORPORTATION | 1 | 1999 |
| US ARMY | 1 | 1995 |
Locations
| Location | Patents | Span |
|---|---|---|
| Phoenix, AZ, US | 18 | 1994–2005 |
| Boxford, Massachusetts, US | 7 | 1977–1980 |
| Rockville, Maryland, US | 1 | 1995 |