Inventor
Tatsuya Kabe
Inventor
Toyama, JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1046%
H01LSemiconductor devices23%
H10DInorganic electric semiconductor devices15%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
PatentTitleYear
10,068,876Semiconductor device and manufacturing method therefor20189,318,471'Semiconductor device and method for fabricating the same'20168,895,431'Method for fabricating semiconductor device'20148,536,704'Semiconductor device and method for fabricating the same'20137,781,339'Method of fabricating semiconductor interconnections'20107,538,027'Fabrication method for semiconductor interconnections'2009Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2009–2010Patents assigned to KOBE STEEL LTD (2)· patent assignee history
2009Based in Sakyo-ku, JP· patent location history
2010Based in Kyoto, JP· patent location history
2013–2014Patents assigned to PANASONIC CORP (2)· patent assignee history
2013Patents assigned to KABE TATSUYA (1)· patent assignee history
2013Patents assigned to MATSUMOTO SUSUMU (1)· patent assignee history
2013–2016Based in Toyama, JP· patent location history
2016–2018Patents assigned to PANASONIC IP MAN CO LTD (2)· patent assignee history
2018Based in Osaka, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| KOBE STEEL LTD | 2 | 2009–2010 |
| PANASONIC CORP | 2 | 2013–2014 |
| PANASONIC IP MAN CO LTD | 2 | 2016–2018 |
| KABE TATSUYAself | 1 | 2013 |
| MATSUMOTO SUSUMU | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Toyama, JP | 3 | 2013–2016 |
| Osaka, JP | 1 | 2018 |
| Kyoto, JP | 1 | 2010 |
| Sakyo-ku, JP | 1 | 2009 |