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Inventor

Daishi Sumi

Inventor
Tokyo, JP

Overview

2→
Patents
2018–2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B33Yprimary
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering20%
B60RVehicles, vehicle fittings, or vehicle parts, not otherwise provided for20%
B62DMotor vehicles20%
F16FSprings20%
F41HArmour20%
PatentTitleYear
10,974,770Network structure, shock-absorbing body, vehicle, and design method of network structure20219,989,333Armor and vehicle2018

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2018–2021Patents assigned to MITSUBISHI HEAVY IND LTD (2)· patent assignee history
2018–2021Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MITSUBISHI HEAVY IND LTD22018–2021
Locations
LocationPatentsSpan
Tokyo, JP22018–2021