Inventor
Mudasir Ahmad
Inventor
San Jose, CA, US
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits24%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
H01LSemiconductor devices11%
Y02PClimate change mitigation technologies in the production or processing of goods9%
Y10TTechnical subjects covered by former us classification9%
B65DContainers for storage or transport of articles or materials, e.g. bags, barrels, bottles, boxes, cans, cartons, crates, drums, jars, tanks, hoppers, forwarding containers4%
F25BRefrigeration machines, plants or systems4%
G01RMeasuring electric variables4%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light4%
H10NElectric solid-state devices not otherwise provided for4%
PatentTitleYear
10,468,318Stiffener for providing uniformity in microelectronic packages201910,260,782Heat dissipation in hermetically-sealed packaged devices201910,230,212Method and apparatus to prevent laser kink failures201910,186,839Laser with pre-distorted grating20199,688,453'Heat dissipation in hermetically-sealed packaged devices'20179,204,548'Electronic devices mounted on multiple substrates'20159,086,267'Real time strain sensing solution'20158,962,388'Method and apparatus for supporting a computer chip on a printed circuit board assembly'20158,952,523'Integrated circuit package lid configured for package coplanarity'20158,736,044'Lid for an electrical hardware component'20148,081,484'Method and apparatus for supporting a computer chip on a printed circuit board assembly'20117,797,663'Conductive dome probes for measuring system level multi-GHZ signals'20107,621,190'Method and apparatus for strain monitoring of printed circuit board assemblies'20097,604,491'Techniques for providing electrical and thermal conductivity between electrical components and printed circuit boards using sleeves defining substantially conical shapes'20097,277,297'Device, apparatus, method and assembly for coupling an electrical component with a circuit board'20077,019,976'Methods and apparatus for thermally coupling a heat sink to a circuit board component'20066,728,104'Methods and apparatus for cooling a circuit board component'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2006Patents assigned to CISCO TECH IND (2)· patent assignee history
2004–2011Based in Santa Clara, CA, US· patent location history
2007–2019Patents assigned to CISCO TECH INC (15)· patent assignee history
2011–2015Patents assigned to AHMAD MUDASIR (5)· patent assignee history
2011–2015Patents assigned to LIU KUO-CHUAN (3)· patent assignee history
2011–2015Patents assigned to NAGAR MOHAN R (3)· patent assignee history
2014–2019Based in San Jose, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| CISCO TECH INC | 15 | 2007–2019 |
| AHMAD MUDASIRself | 5 | 2011–2015 |
| LIU KUO-CHUAN | 3 | 2011–2015 |
| NAGAR MOHAN R | 3 | 2011–2015 |
| CISCO TECH IND | 2 | 2004–2006 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Jose, California, US | 10 | 2014–2019 |
| Santa Clara, California, US | 7 | 2004–2011 |