Inventor
Toshiki Miyai
Inventor
Tokyo, JP
Overview
Patents· 24 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
C09JAdhesives16%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
B23KSoldering or unsoldering14%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds5%
C08LCompositions of macromolecular compounds2%
B28DWorking stone or stone-like materials1%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form1%
H10DInorganic electric semiconductor devices1%
PatentTitleYear
11,127,633Wafer processing method including a thermocompression bonding step of bonding a wafer to a ring frame via a polyolefin sheet202111,069,574Wafer processing method including applying a polyester sheet to a wafer202111,062,948Wafer processing method202111,056,334Wafer processing method using a ring frame and a polyester sheet202111,049,757Wafer processing method including applying a polyester sheet to a wafer202111,049,772Wafer processing method including applying a polyester sheet to a wafer202111,043,421Wafer processing method202111,037,814Wafer processing method using a ring frame with a polyester sheet with no adhesive layer202111,037,813Wafer processing method202111,031,234Wafer processing method including applying a polyolefin sheet to a wafer202111,024,543Wafer processing method including applying a polyester sheet to a wafer202111,018,043Wafer processing method using a ring frame and a polyester sheet202111,018,058Wafer processing method for dividing a wafer along predefined division lines using polyester sheet202111,011,407Wafer processing method using a ring frame and a polyolefin sheet202111,004,744Wafer processing method for dividing a wafer along predefined division lines202110,998,232Wafer processing method of uniting a wafer and a ring frame using a polyolefin sheet202110,991,587Wafer processing method including applying a polyester sheet to a wafer202110,991,624Wafer processing method including applying a polyolefin sheet to a wafer202110,985,066Wafer processing method for dividing a wafer along division lines202110,985,067Wafer processing method using a laser beam dividing step202110,910,269Wafer processing method202110,896,850Wafer processing method202110,847,420Wafer processing method202010,720,355Wafer processing method2020Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2020–2021Patents assigned to DISCO CORP (24)· patent assignee history
2020–2021Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| DISCO CORP | 24 | 2020–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 24 | 2020–2021 |