Inventor
MICHIO SAKURAI
Inventor
JP
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering28%
G01BMeasuring length, thickness or similar linear dimensions24%
G01NInvestigating or analysing materials by determining their chemical or physical properties7%
G06NComputing arrangements based on specific computational models7%
H01LSemiconductor devices7%
H10DInorganic electric semiconductor devices7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
G06TImage data processing or generation, in general3%
H01GCapacitors3%
H10BElectronic memory devices3%
PatentTitleYear
12,571,742Appearance inspection device, welding system, and method for appearance inspection of a weld202612,568,819Semiconductor structure202612,459,054Laser welding device and laser welding method202512,389,613Semiconductor structure202512,076,817Laser welding device202412,017,299Laser welding method202411,999,008Laser welding device and laser welding method202411,964,339Laser welding device and laser welding method202411,872,657Welding system, and method for welding workpiece in which same is used202411,511,370Laser welding method2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to PANASONIC IP MAN CO LTD (8)· patent assignee history
2022–2026Based in JP· patent location history
2025–2026Patents assigned to POWERCHIP SEMICONDUCTOR MFG CORP (2)· patent assignee history
2025–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| PANASONIC IP MAN CO LTD | 8 | 2022–2026 |
| POWERCHIP SEMICONDUCTOR MFG CORP | 2 | 2025–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 8 | 2022–2026 |
| TW | 2 | 2025–2026 |