Inventor
Sung-Hui Huang
Inventor
Dongshan Township, TW
Overview
Patents· 44 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
H01LSemiconductor devices17%
H10DInorganic electric semiconductor devices10%
G06FElectric digital data processing7%
G02BOptical elements, systems or apparatus5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein4%
H10KOrganic electric solid-state devices4%
B23KSoldering or unsoldering3%
G09GArrangements or circuits for control of indicating devices using static means to present variable information3%
PatentTitleYear
11,036,962Fingerprint enrollment method, electronic apparatus and computer-readable storage medium thereof202110,872,871Chip package structure with dummy bump and method for forming the same202010,867,951Semiconductor device202010,866,373Optical transceiver and manufacturing method thereof202010,847,485Chip package structure and method for forming the same202010,790,254Chip package structure202010,770,405Thermal interface material having different thicknesses in packages202010,746,923Photonic semiconductor device and method202010,707,177Thermal interface material having different thicknesses in packages202010,656,351Package structure for optical fiber and method for forming the same202010,629,545Semiconductor device202010,510,603Conductive vias in semiconductor packages and methods of forming same201910,459,159Photonic package and method forming same201910,340,242Semiconductor device and method of manufacturing the same201910,276,532Three-dimensional chip stack and method of forming the same201910,267,988Photonic package and method forming same20199,698,115'Three-dimensional chip stack and method of forming the same'20179,355,980'Three-dimensional chip stack and method of forming the same'20169,182,641'Signal line structure of a flat display'20159,081,249'Electrophoresis display apparatus'20158,895,385'Methods of forming semiconductor structures'20148,890,224'Semiconductor structures having a metal-insulator-metal capacitor structure'20148,835,913'Transistor structure'20148,791,909'Display panel'20148,780,146'Driving member and driving member array module'20148,723,843'Pixel driving circuit with capacitor having threshold voltages information storing function, pixel driving method and light emitting display device'20148,655,197'Electronic paper structure and method for fabricating electronic paper'20148,643,005'Organic light emitting display device and method for manufacturing the same'20148,576,475'MEMS switch'20138,564,103'Method of manufacturing an electronic device'20138,552,485'Semiconductor structure having metal-insulator-metal capacitor structure'20138,546,235'Integrated circuits including metal-insulator-metal capacitors and methods of forming the same'20138,466,614'Front light plate and reflective display apparatus using the same'20138,411,047'Touch-sensitive display panel'20138,395,095'Electrothermal transfer device and electrothermal transfer method'20138,358,287'Sensing structure and displayer comprising the same'20138,358,167'Photo sensing unit and photo sensor thereof'20138,350,260'Transistor structure'20138,336,358'Wire stretching device'20128,314,020'Method for patterning a metal layer and method for manufacturing semiconductor devices by using the same'20128,274,085'Pixel structure and fabrication method thereof'20128,164,579'Sensing structure and displayer comprising the same'20128,138,548'Thin film transistor array substrate and method for manufacturing the same'20128,023,174'MEMS array substrate and display device using the same'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2015Patents assigned to E INK HOLDINGS INC (21)· patent assignee history
2011–2015Based in Hsinchu, TW· patent location history
2012–2015Patents assigned to HUANG SUNG-HUI (22)· patent assignee history
2012–2015Patents assigned to SHINN TED-HONG (10)· patent assignee history
2012–2015Patents assigned to LAN WEI-CHOU (7)· patent assignee history
2012–2014Based in Taipei, TW· patent location history
2012–2013Based in Jhubei City, TW· patent location history
2013–2020Based in Dongshan Township, TW· patent location history
2017–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (16)· patent assignee history
2019–2020Based in Yilan County, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HUANG SUNG-HUIself | 22 | 2012–2015 |
| E INK HOLDINGS INC | 21 | 2011–2015 |
| TAIWAN SEMICONDUCTOR MFG CO LTD | 16 | 2017–2020 |
| SHINN TED-HONG | 10 | 2012–2015 |
| LAN WEI-CHOU | 7 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Dongshan Township, TW | 15 | 2013–2020 |
| Hsinchu, TW | 14 | 2011–2015 |
| Yilan County, TW | 7 | 2019–2020 |
| Taipei, TW | 3 | 2012–2014 |
| Jhubei City, TW | 2 | 2012–2013 |