LexDanaLexDanabeta
Inventor

Herbert Brunner

Inventor
Regensburg, DE

Overview

78→
Patents
1981–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 78 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Hprimary
H10HInorganic light-emitting semiconductor devices having potential barriers28%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation12%
H01LSemiconductor devices5%
H05KPrinted circuits5%
Y02PClimate change mitigation technologies in the production or processing of goods3%
B29CShaping or joining of plastics2%
C09KMaterials for miscellaneous applications, not provided for elsewhere2%
G21FProtection against x-radiation, gamma radiation, corpuscular radiation or particle bombardment2%
G02BOptical elements, systems or apparatus1%
PatentTitleYear
11,038,090Method of producing an optoelectronic component202110,483,444Method of producing an optoelectronic semiconductor component, optoelectronic semiconductor component, and temporary carrier20199,911,719'Semiconductor component, lighting device and method for producing a semiconductor component'20189,554,458'Mounting carrier and method of mounting a mounting carrier on a connecting carrier'20179,406,847'Optoelectronic semiconductor component, conversion-medium lamina and method for producing a conversion-medium lamina'20169,406,853'Method for manufacturing at least one optoelectronic semiconductor device'20169,318,357'Method for producing a multiplicity of optoelectronic semiconductor components'20169,293,671'Optoelectronic component and method for producing an optoelectronic component'20169,281,453'Method for producing an optoelectronic component, and optoelectronic component'20168,853,732'Optoelectronic component'20148,835,937'Optoelectronic component, device comprising a plurality of optoelectronic components, and method for the production of an optoelectronic component'20148,816,375'Radiation-emitting semiconductor body, method for producing a radiation-emitting semiconductor body and radiation-emitting semiconductor component'20148,735,930'Optoelectronic component with multi-part housing body'20148,723,198'Wavelength-converting converter material, light-emitting optical component, and method for the production thereof'20148,716,729'Lighting device'20148,690,629'Luminescence conversion LED'20148,487,323'LED housing system'20138,476,655'Electromagnetic-radiation-emitting optoelectronic component and method for producing an optoelectronic component'20138,461,616'Semiconductor arrangement'20138,450,847'Optoelectronic semiconductor chip fitted with a carrier'20138,435,806'Method for the manufacture of an optoelectronic component and an optoelectronic component'20138,331,746'Illumination unit comprising luminescence diode chip and optical waveguide, method for producing an illumination unit and LCD display'20128,278,767'Optoelectronic component'20128,247,263'Method for producing an optical, radiation-emitting component and optical, radiation-emitting component'20128,227,821'Housing for an optoelectronic component, optoelectronic component and method for the production of an optoelectronic component'20128,097,937'Leadframe and housing for radiation-emitting component, radiation-emitting component, and a method for producing the component'20127,965,031'White-emitting LED having a defined color temperature'20117,906,352'Chip and method for producing a chip'20117,851,988'Green-emitting LED'20107,838,357'Optoelectronic component'20107,825,574'High-efficiency led-based illumination system with improved color rendering'20107,824,941'Method for producing an LED light source comprising a luminescence conversion element'20107,718,451'Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body'20107,696,590'Diode housing'20107,688,400'Light source element with lateral, angular light injection'20107,688,401'Light source element with lateral, oblique light infeed'20107,675,132'Surface mounting optoelectronic component and method for producing same'20107,666,715'Radiation-emitting and/or radiation-receiving semiconductor component and method for the production thereof'20107,510,890'Method for producing a luminescence diode chip'20097,510,888'LED arrangement'20097,446,347'Optoelectronic component and method for the production thereof, module and device comprising a module of this type'20087,435,997'Component comprising a large number of light-emitting-diode chips'20087,436,002'Surface-mountable radiation-emitting component'20087,368,329'Diode housing'20087,319,245'Radiation emitting semiconductor component with luminescent conversion element'20087,288,831'Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof'20077,247,940'Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body'20077,223,620'Process for the production of light-emitting diode light sources with a luminescence conversion element'20077,208,769'LED arrangement'20077,199,454'Optoelectronic semiconductor component'20077,183,661'Epoxy-resin systems, which are resistant to aging, moulding materials, components produced therefrom and the use thereof'20077,138,301'Diode housing'20067,109,590'Semiconductor component comprising a surface metallization'20067,105,862'Diode housing'20067,102,212'Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof'20067,078,253'Radiation emitting semiconductor component with luminescent conversion element'20067,005,311'Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof'20066,975,011'Optoelectronic semiconductor component having multiple external connections'20056,946,714'Surface mounting optoelectronic component and method for producing same'20056,927,469'Surface mountable light emitting or receiving device'20056,897,490'Radiation emitting semiconductor component with luminescent conversion element'20056,858,879'Diode housing'20056,716,673'Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof'20046,645,783'Method of producing an optoelectronic component'20036,624,491'Diode housing'20036,610,563'Surface mounting optoelectronic component and method for producing same'20036,459,130'Optoelectronic semiconductor component'20026,432,745'Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof'2002RE037554'Method for producing an optoelectronic semiconductor component'20026,087,680'Led device'20005,999,552'Radiation emitter component'19995,985,696'Method for producing an optoelectronic semiconductor component'19995,981,979'Radiation-emitting semiconductor component'19995,742,098'Semiconductor component with plastic sheath and method for producing the same'19984,762,690'Process for the separation of cations from aqueous solutions'19884,472,298'Process for embedding radioactive, especially tritium containing waste'19844,439,403'Apparatus for conditioning bioinjurious waste'19844,295,745'Apparatus for conditioning bioinjurious waste'1981

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1981–1988Based in Hanau, DE· patent location history
1984–2016Patents assigned to BRUNNER HERBERT (22)· patent assignee history
1998–2004Patents assigned to SIEMENS AG (10)· patent assignee history
1998Based in Rebensburg, DE· patent location history
1999–2012Based in Regensburg, DE· patent location history
2003–2019Patents assigned to OSRAM OPTO SEMICONDUCTORS GMBH (42)· patent assignee history
2005–2014Patents assigned to OSRAM GMBH (23)· patent assignee history
2007–2021Based in Sinzing, DE· patent location history
2012–2014Patents assigned to BOGNER GEORG (4)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
OSRAM OPTO SEMICONDUCTORS GMBH422003–2019
OSRAM GMBH232005–2014
BRUNNER HERBERTself221984–2016
SIEMENS AG101998–2004
BOGNER GEORG42012–2014
Locations
LocationPatentsSpan
Regensburg, DE371999–2012
Sinzing, DE362007–2021
Hanau, DE41981–1988
Rebensburg, DE11998