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Inventor

Tatsuyuki Okubo

Inventor
Tokyo, JP

Overview

8→
Patents
2009–2014
Patent span
Electricity
Primary field (CPC H)

Patents· 8 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1030%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
Y10TTechnical subjects covered by former us classification22%
H10DInorganic electric semiconductor devices19%
PatentTitleYear
8,703,583'Fabrication method of semiconductor device'20148,492,173'Manufacturing method for semiconductor integrated device'20138,460,491'Die bonder and bonding method'20138,372,665'Manufacturing method for semiconductor integrated device'20138,222,050'Manufacturing method for semiconductor integrated device'20128,003,495'Manufacturing method for semiconductor integrated device'20117,888,141'Manufacturing method for semiconductor integrated device'20117,629,231'Fabrication method of semiconductor device'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009–2014Based in Tokyo, JP· patent location history
2011–2014Patents assigned to RENESAS ELECTRONICS CORP (6)· patent assignee history
2012–2014Patents assigned to OKUBO TATSUYUKI (4)· patent assignee history
2012–2014Patents assigned to MAKI HIROSHI (3)· patent assignee history
2012–2013Patents assigned to YOKOMORI TSUYOSHI (2)· patent assignee history
2013Based in Kumagaya, JP· patent location history
2014Patents assigned to FUKASAWA HARUHIKO (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
RENESAS ELECTRONICS CORP62011–2014
OKUBO TATSUYUKIself42012–2014
MAKI HIROSHI32012–2014
YOKOMORI TSUYOSHI22012–2013
FUKASAWA HARUHIKO12014
Locations
LocationPatentsSpan
Tokyo, JP72009–2014
Kumagaya, JP12013