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Inventor

HSIAO-CHUNG LIANG

Inventor
TW

Overview

4→
Patents
2022–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
PatentTitleYear
12,463,067Pickup apparatus and method of using the same202511,749,582Package structure202311,444,002Package structure202211,233,032Mechanisms for forming bonding structures2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (4)· patent assignee history
2022–2025Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD42022–2025
Locations
LocationPatentsSpan
TW42022–2025