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Inventor

SEIJI KATSUOKA

Inventor
JP

Overview

2→
Patents
2022–2023
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary
B24BMachines, devices, or processes for grinding or polishing29%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1029%
H01LSemiconductor devices14%
Y02PClimate change mitigation technologies in the production or processing of goods14%
Y10TTechnical subjects covered by former us classification14%
PatentTitleYear
11,583,973Polishing apparatus202311,426,834Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2023Patents assigned to EBARA CORP (2)· patent assignee history
2022–2023Based in JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
EBARA CORP22022–2023
Locations
LocationPatentsSpan
JP22022–2023