LexDanaLexDanabeta
Inventor

Rikiya Katoh

Inventor
Sohka, JP

Overview

4→
Patents
2000–2003
Patent span
Performing operations
Primary field (CPC B)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering44%
C22CAlloys22%
H05KPrinted circuits22%
Y02PClimate change mitigation technologies in the production or processing of goods11%
PatentTitleYear
6,554,180'Lead-free solder paste'20036,503,338'Lead-free solder alloys'20036,220,501'Method of joining metallic members, and joined metallic members'20016,050,480'Solder paste for chip components'2000

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2000–2003Patents assigned to SENJU METAL INDUSTRY CO (3)· patent assignee history
2000Based in Soka, JP· patent location history
2001Patents assigned to TOSHIBA KK (1)· patent assignee history
2001Based in Saitama, JP· patent location history
2003Based in Sohka, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SENJU METAL INDUSTRY CO32000–2003
TOSHIBA KK12001
Locations
LocationPatentsSpan
Sohka, JP22003
Saitama, JP12001
Soka, JP12000