Inventor
Behdad Jafari
Inventor
Saratoga, CA, US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1054%
G06FElectric digital data processing23%
H05KPrinted circuits23%
PatentTitleYear
8,837,161'Multi-configuration processor-memory substrate device'20148,482,120'Combined heat sink multi-configuration processor memory substrate device'20138,264,851'Multi-configuration processor-memory substrate device'20128,198,727'Integrated circuit/substrate interconnect system and method of manufacture'20127,838,999'System and method of manufacture for interconnecting an integrated circuit and a substrate'20107,254,033'Method and apparatus for heat dissipation'20076,894,385'Integrated circuit package having bypass capacitors coupled to bottom of package substrate and supporting surface mounting technology'2005Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2005–2014Patents assigned to NVIDIA CORP (6)· patent assignee history
2005–2014Based in Saratoga, CA, US· patent location history
2007–2014Patents assigned to JAFARI BEHDAD (5)· patent assignee history
2007–2012Patents assigned to SINGH INDERJIT (2)· patent assignee history
2012–2013Patents assigned to SORENSEN GEORGE (2)· patent assignee history
2012Patents assigned to CHEN RAY (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NVIDIA CORP | 6 | 2005–2014 |
| JAFARI BEHDADself | 5 | 2007–2014 |
| SINGH INDERJIT | 2 | 2007–2012 |
| SORENSEN GEORGE | 2 | 2012–2013 |
| CHEN RAY | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Saratoga, California, US | 7 | 2005–2014 |