Inventor
HIROKAZU KOMORI
Inventor
JP
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H02Gprimary
H02GInstallation of electric cables or lines, or of combined optical and electric cables or lines15%
H01BCables14%
B60RVehicles, vehicle fittings, or vehicle parts, not otherwise provided for9%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients8%
C08LCompositions of macromolecular compounds8%
H01RElectrically-conductive connections8%
C08JWorking-up6%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form5%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds5%
H05KPrinted circuits5%
PatentTitleYear
12,573,790Connector-equipped electrical wire and connector housing202612,462,952Cable with abnormality precursor detection function and electric wire abnormality precursor detection device202512,308,141Wiring module and elastic waterproofing member202512,296,764Wiring module202512,296,763Wiring module202512,267,954Fluororesin composition, fluororesin sheet, laminate and substrate for circuits202512,261,424Fixing structure of wiring member and wiring member202512,172,589Door component, grommet, and wiring module202412,142,400Wiring module and elastic waterproofing member202412,128,834Wiring member202412,126,156Fixing structure of wiring member, and wiring member with joint member202412,034,285Hot melt block, cable manufacturing method, and cable202411,963,297Fluororesin composition, fluororesin sheet, laminate and substrate for circuits202411,939,450Resin composition for circuit board, molded body for circuit board, layered body for circuit board, and circuit board202411,866,570Molding powder202411,555,098Molding powder202311,329,422Wire cover and connector with wire cover202211,296,453Waterproof structure of connector202211,227,704Multicore cable waterproofing structure202211,189,963Connector202111,165,177Board connector2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to AUTONETWORKS TECHNOLOGIES LTD (16)· patent assignee history
2021–2026Patents assigned to SUMITOMO ELECTRIC INDUSTRIES (16)· patent assignee history
2021–2026Patents assigned to SUMITOMO WIRING SYSTEMS (16)· patent assignee history
2021–2026Based in JP· patent location history
2023–2025Patents assigned to DAIKIN IND LTD (5)· patent assignee history
2025Patents assigned to SUMITOMO WIRING SYTEMS LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AUTONETWORKS TECHNOLOGIES LTD | 16 | 2021–2026 |
| SUMITOMO ELECTRIC INDUSTRIES | 16 | 2021–2026 |
| SUMITOMO WIRING SYSTEMS | 16 | 2021–2026 |
| DAIKIN IND LTD | 5 | 2023–2025 |
| SUMITOMO WIRING SYTEMS LTD | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 21 | 2021–2026 |