Inventor
Brian Harkness
Inventor
Midland, MI, US
Overview
Patents· 33 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C08Gprimary
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds16%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients12%
C08LCompositions of macromolecular compounds12%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices11%
C09DCoating compositions, e.g. paints, varnishes or lacquers10%
Y10TTechnical subjects covered by former us classification4%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry3%
C09KMaterials for miscellaneous applications, not provided for elsewhere3%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h103%
C09JAdhesives2%
PatentTitleYear
10,982,052Silicone block copolymer having an aminofunctional endblocking group and method for its preparation and use202110,920,078Silicone-polyether copolymer, sealants comprising same, and related methods202110,800,921Isocyanate-functional silicone-polyether copolymer, silicone-polyether-urethane copolymer formed therewith, sealants comprising same, and related methods202010,738,191Silicone-polyether copolymer, isocyanate-functional silicone-polyether copolymer formed therewith, silicone-polyether-urethane copolymer, sealants comprising same, and related methods202010,676,568Silicone-polyether copolymer, method of preparing same, and sealant comprising same202010,473,822Optical element20199,346,945'Filled silicone composition, in situ preparation and use thereof'20168,734,708'Polar polydimethysiloxane molds, methods of making the molds, and methods of using the molds for pattern transfer'20148,647,964'Temporary wafer bonding method for semiconductor processing'20148,486,615'Photopolymerizable silicone materials forming semipermeable membranes for sensor applications'20138,258,502'Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones'20128,227,181'Method of preparing a patterned film with a developing solvent'20128,147,742'Lithography processes using phase change compositions'20127,541,264'Temporary wafer bonding method for semiconductor processing'20097,517,808'Method for forming and removing a patterned silicone film'20096,924,346'Etch-stop resins'20056,737,117'Hydrosilsesquioxane resin compositions having improved thin film properties'20046,617,674'Semiconductor package and method of preparing same'20036,265,086'Electroless metal deposition on silyl hydride functional resin'20016,258,506'Ultraviolet-curable polysiloxane composition and method for the formation of cured patterns therefrom'20016,096,483'Radiation-curable composition and method for manufacturing cured-product patterns therefrom'20006,051,625'Ultraviolet-curable polysiloxane composition and method for the formation of cured patterns therefrom'20006,001,928'Polymerization of cyclosiloxanes in the presence of fillers'19995,919,298'Method for preparing hydrophobic fumed silica'19995,908,660'Method of preparing hydrophobic precipitated silica'19995,891,529'Radiation curable sompositions'19995,861,235'Ultraviolet-curable composition and method for patterning the cured product therefrom'19995,861,468'Curable siloxane polymer composition and method of curing'19995,820,944'Ultraviolet-curable composition and method for forming cured-product patterns therefrom'19985,789,460'Radiation curable compositions'19985,614,603'Thermosetting silicone resins'19975,516,871'Diphenylsiloxane oligomers functionalized at both terminals and methods for the preparation thereof'19965,502,229'Diphenylsiloxane oligomers functionalized at both terminal and method for the preparation thereof'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996–2001Patents assigned to DOW CORNING ASIA LTD (11)· patent assignee history
1996Based in Kanagawa, JP· patent location history
1997–2001Based in South Glamorgan, GB· patent location history
1998–2000Based in Cowbridge, GB· patent location history
1999–2019Patents assigned to DOW CORNING (16)· patent assignee history
2001–2021Based in Midland, MI, US· patent location history
2012–2016Patents assigned to HARKNESS BRIAN (5)· patent assignee history
2019–2021Patents assigned to DOW SILICONES CORP (6)· patent assignee history
2020–2021Patents assigned to DOW GLOBAL TECHNOLOGIES LLC (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| DOW CORNING | 16 | 1999–2019 |
| DOW CORNING ASIA LTD | 11 | 1996–2001 |
| DOW SILICONES CORP | 6 | 2019–2021 |
| HARKNESS BRIANself | 5 | 2012–2016 |
| DOW GLOBAL TECHNOLOGIES LLC | 4 | 2020–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Midland, MI, US | 19 | 2001–2021 |
| South Glamorgan, GB | 6 | 1997–2001 |
| Cowbridge, GB | 6 | 1998–2000 |
| Kanagawa, JP | 2 | 1996 |