Inventor
Zheng Zheng
Inventor
Beijing, CN
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light13%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein13%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light13%
G01NInvestigating or analysing materials by determining their chemical or physical properties10%
G06FElectric digital data processing10%
C40BCombinatorial chemistry3%
G06NComputing arrangements based on specific computational models3%
G11CStatic stores3%
G16BBioinformatics, i.e. information and communication technology [ict] specially adapted for genetic or protein-related data processing in computational molecular biology3%
PatentTitleYear
10,585,787Construction method of software accelerated testing technology based on noise resonance202010,395,743Method and system for implementing one-wire programmable circuit201910,332,616Movable type method applied to protein-ligand binding20199,885,614'Method and apparatus for multifrequency optical comb generation'20189,863,815'Method and apparatus for multifrequency optical comb generation'20189,273,994'Method and apparatus for optical asynchronous sampling signal measurements'20169,250,128'Method and apparatus for optical asynchronous sampling signal measurements'20168,836,931'Detection system and method for acquiring resonance angle of surface plasmon'20148,637,974'Integrated circuit packaging system with tiebar-less design and method of manufacture thereof'20148,416,416'Measuring method for SPR and system thereof'20138,110,913'Integrated circuit package system with integral inner lead and paddle'20127,064,420'Integrated circuit leadframe with ground plane'20066,876,069'Ground plane for exposed package'20056,630,373'Ground plane for exposed package'20036,380,048'Die paddle enhancement for exposed pad in semiconductor packaging'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2005Patents assigned to ST ASSEMBLY TEST SERVICES PTE (2)· patent assignee history
2002–2014Based in Singapore, SG· patent location history
2012–2014Patents assigned to ZHENG ZHENG (4)· patent assignee history
2013–2020Patents assigned to UNIV BEIHANG (7)· patent assignee history
2013–2014Patents assigned to FAN JIANGFENG (2)· patent assignee history
2013–2014Patents assigned to NAT CT NANOSCIENCE NCNST CHINA (2)· patent assignee history
2013–2020Based in Beijing, CN· patent location history
2019Based in Xiamen, CN· patent location history
2019Based in Gainesville, FL, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNIV BEIHANG | 7 | 2013–2020 |
| ZHENG ZHENGself | 4 | 2012–2014 |
| FAN JIANGFENG | 2 | 2013–2014 |
| NAT CT NANOSCIENCE NCNST CHINA | 2 | 2013–2014 |
| ST ASSEMBLY TEST SERVICES PTE | 2 | 2002–2005 |
Locations
| Location | Patents | Span |
|---|---|---|
| Beijing, CN | 7 | 2013–2020 |
| Singapore, SG | 6 | 2002–2014 |
| Xiamen, CN | 1 | 2019 |
| Gainesville, Florida, US | 1 | 2019 |