LexDanaLexDanabeta
Inventor

Chih-Wei Wu

Inventor
Zhuangwei Township, TW

Overview

58→
Patents
2005–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 58 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H01LSemiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
H10DInorganic electric semiconductor devices3%
LOC143%
G06FElectric digital data processing2%
H10HInorganic light-emitting semiconductor devices having potential barriers2%
Y02PClimate change mitigation technologies in the production or processing of goods2%
H04MTelephonic communication1%
A61FFilters implantable into blood vessels1%
PatentTitleYear
10,872,862Package structure having bridge structure for connection between semiconductor dies and method of fabricating the same202010,867,962Packaging process and manufacturing method202010,867,965Package structures and methods of forming the same202010,861,799Dummy die placement without backside chipping202010,804,178Integrated circuit package and method of forming same202010,756,058Semiconductor package and manufacturing method thereof202010,741,467Die-on-interposer assembly with dam structure and method of manufacturing the same202010,586,763Semiconductor device and method of manufacture2020D0872040Super thin two-screen display202010,529,690Package structures and methods of forming the same202010,529,637Integrated circuit package and method of forming same202010,510,732PoP device and method of forming the same201910,510,684Three dimensional integrated circuit (3DIC) with support structures201910,510,595Integrated fan-out packages and methods of forming the same201910,497,690Semiconductor package, method for forming semiconductor package, and method for forming semiconductor assembly201910,490,474Die-on-interposer assembly with dam structure and method of manufacturing the same201910,483,234Chip packages and methods of manufacture thereof201910,340,253Package structure and method of manufacturing the same201910,319,780Light-emitting element having a plurality of light-emitting structures201910,290,773Light-emitting device201910,269,589Method of manufacturing a release film as isolation film in package201910,269,731Apparatus for dicing interposer assembly201910,253,232Method of lubricating a rotary screw compressor201910,170,441Semiconductor structure and manufacturing method thereof201910,157,870Integrated fan-out package and method of fabricating the same201810,157,850Semiconductor packages and manufacturing method thereof201810,115,650Die-on-interposer assembly with dam structure and method of manufacturing the same201810,008,218Blind bandwidth extension using K-means and a support vector machine20189,987,734Flat clinch anvil assembly20189,929,109'Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structure'20189,768,227'Light-emitting element having a plurality of light-emitting structures'20179,704,825'Chip packages and methods of manufacture thereof'20179,570,421'Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structure'20179,530,646'Method of forming a semiconductor structure'20169,449,567'Common voltage compensation in display apparatus'20169,368,458'Die-on-interposer assembly with dam structure and method of manufacturing the same'20169,337,096'Apparatus and methods for molding die on wafer interposers'20169,293,369'Three-dimensional integrated circuit (3DIC)'20168,946,893'Apparatus for dicing interposer assembly'20158,749,077'Three-dimensional integrated circuit (3DIC)'20148,580,683'Apparatus and methods for molding die on wafer interposers'20138,569,086'Semiconductor device and method of dicing semiconductor devices'20138,557,684'Three-dimensional integrated circuit (3DIC) formation process'20138,541,883'Semiconductor device having shielded conductive vias'20138,518,753'Assembly method for three dimensional integrated circuit'20138,501,590'Apparatus and methods for dicing interposer assembly'20138,460,394'Gripping mechanism'20138,254,532'Network videoconference equipment and its method of proceeding network videoconference'20128,225,025'Motherboard with selected sub-system controlling shared peripherals'20127,851,895'Semiconductor structure and semiconductor manufacturing method'20107,663,204'Substrate for multi-chip stacking, multi-chip stack package utilizing the substrate and its applications'20107,474,527'Desktop personal computer and thermal module thereof'20097,379,051'Foldable computer mouse'20087,376,444'Method and apparatus for radio frequency identification'20087,054,670'Cellular phone structure and portable electronic apparatus'2006D0514573'Mouse'2006D0511518'Mouse'2005D0509506'Pen mouse'2005

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2005–2013Based in Taipei, TW· patent location history
2010–2019Based in Hsinchu, TW· patent location history
2010–2013Based in Kaohsiung, TW· patent location history
2012–2013Patents assigned to WU CHIH-WEI (8)· patent assignee history
2013–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (10)· patent assignee history
2013Patents assigned to LIN JING-CHENG (5)· patent assignee history
2013Patents assigned to LU SZU WEI (5)· patent assignee history
2013–2020Based in Zhuangwei Township, TW· patent location history
2017–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (26)· patent assignee history
2018–2020Based in Yilan County, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD262017–2020
TAIWAN SEMICONDUCTOR MFG102013–2016
WU CHIH-WEIself82012–2013
LIN JING-CHENG52013
LU SZU WEI52013
Locations
LocationPatentsSpan
Zhuangwei Township, TW272013–2020
Taipei, TW102005–2013
Yilan County, TW92018–2020
Hsinchu, TW52010–2019
Kaohsiung, TW22010–2013