Inventor
Yoshihiro Inao
Inventor
Kawasaki, JP
Overview
Patents· 39 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1024%
Y10TTechnical subjects covered by former us classification21%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form14%
H01LSemiconductor devices12%
C09JAdhesives5%
B24BMachines, devices, or processes for grinding or polishing2%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds2%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h102%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%
B25JManipulators2%
PatentTitleYear
9,962,915Bonding method and bonding apparatus20189,682,532'Laminated body and method for separating laminated body'20179,653,337'Transport arm, transport apparatus and transport method'20179,627,235'Supporting member separation method'20179,548,232'Attaching apparatus'20179,492,986'Laminate and method for separating the same'20169,484,238'Attachment method'20169,352,542'Processing method and processing apparatus'20169,337,074'Attaching device and attaching method'20169,308,715'Laminate and method for separating the same'20169,281,225'Substrate processing apparatus and substrate processing method'20169,272,494'Sticking apparatus and sticking method'20169,238,357'Supporting member separation apparatus and supporting member separation method'20169,048,311'Laminate and method for separating the same'20158,931,535'Attaching device and attaching apparatus for supporting plate, and attaching method for supporting plate'20158,882,096'Perforated support plate'20148,449,691'Liquid solvent abutment unit'20138,426,543'Adhesive composition and adhesive film'20138,377,256'Stripping device and stripping method'20138,354,157'Support plate, method for producing the same, and method for processing substrate'20138,302,651'Stripping device and stripping method'20128,297,331'Separating apparatus and separating method'20128,298,365'Sticking method and sticking apparatus'20128,186,410'Separating device'20128,167,687'Method of thinning wafer and support plate'20128,163,836'Adhesive composition and adhesive film'20128,148,457'Adhesive composition and film adhesive'20128,136,564'Attaching device and attaching apparatus for supporting plate, and attaching method for supporting plate'20128,097,087'Method of cleaning support plate'20128,080,123'Supporting plate, apparatus and method for stripping supporting plate'20118,080,121'Method of bonding, thinning, and releasing wafer'20117,999,052'Process for producing an adhesive composition'20117,919,394'Method for thinning substrate and method for manufacturing circuit device'20117,849,905'Stripping device and stripping apparatus'2010D0552565'Supporting plate'20077,268,061'Substrate attaching method'20077,237,967'Developing apparatus and method'2007D0544452'Supporting plate'20076,893,172'Developing apparatus and developing method'2005Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2005–2018Patents assigned to TOKYO OHKA KOGYO CO LTD (38)· patent assignee history
2005–2015Based in Kanagawa, JP· patent location history
2011–2017Patents assigned to INAO YOSHIHIRO (19)· patent assignee history
2011–2015Patents assigned to NAKAMURA AKIHIKO (11)· patent assignee history
2011–2015Patents assigned to MIYANARI ATSUSHI (10)· patent assignee history
2011–2018Based in Kawasaki, JP· patent location history
2012–2013Patents assigned to IWATA YASUMASA (6)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOKYO OHKA KOGYO CO LTD | 38 | 2005–2018 |
| INAO YOSHIHIROself | 19 | 2011–2017 |
| NAKAMURA AKIHIKO | 11 | 2011–2015 |
| MIYANARI ATSUSHI | 10 | 2011–2015 |
| IWATA YASUMASA | 6 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kawasaki, JP | 26 | 2011–2018 |
| Kanagawa, JP | 13 | 2005–2015 |