Inventor
Ruqiang Bao
Inventor
Niskayuna, NY, US
Overview
Patents· 134 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices34%
H10DInorganic electric semiconductor devices33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
B82YSpecific uses or applications of nanostructures5%
H10BElectronic memory devices4%
H03BGeneration of oscillations, directly or by frequency-changing, by circuits employing active elements which operate in a non-switching manner0%
H03JTuning resonant circuits0%
H05KPrinted circuits0%
H10NElectric solid-state devices not otherwise provided for0%
PatentTitleYear
11,107,814Vertical fin field effect transistor devices with a replacement metal gate202111,094,801Oxide isolated fin-type field-effect transistors202111,075,281Additive core subtractive liner for metal cut etch processes202111,011,517Semiconductor structure including first FinFET devices for low power applications and second FinFET devices for high power applications202111,004,850Vertical fin field effect transistor devices with a replacement metal gate202110,985,075Gate formation scheme for n-type and p-type transistors having separately tuned threshold voltages202110,971,399Oxygen-free replacement liner for improved transistor performance202110,971,626Interface charge reduction for SiGe surface202110,957,696Self-aligned metal gate with poly silicide for vertical transport field-effect transistors202110,957,646Hybrid BEOL metallization utilizing selective reflection mask202110,943,989Gate to source/drain leakage reduction in nanosheet transistors via inner spacer optimization202110,937,648Gate stack designs for analog and logic devices in dual channel Si/SiGe CMOS202110,930,734Nanosheet FET bottom isolation202110,903,418Low resistance electrode for high aspect ratio confined PCM cell in BEOL202110,903,124Transistor structure with n/p boundary buffer202110,892,339Gate first technique in vertical transport FET using doped silicon gates with silicide202110,832,975Reduced static random access memory (SRAM) device foot print through controlled bottom source/drain placement202010,833,146Horizontal-trench capacitor202010,804,368Semiconductor device having two-part spacer202010,797,163Leakage control for gate-all-around field-effect transistor devices202010,790,271Perpendicular stacked field-effect transistor device202010,790,199Dual channel silicon/silicon germanium complementary metal oxide semiconductor performance with interface engineering202010,777,469Self-aligned top spacers for vertical FETs with in situ solid state doping202010,777,659Self-aligned bottom source/drain epitaxial growth in vertical field effect transistors202010,756,194Shared metal gate stack with tunable work function202010,749,012Formation of self-aligned bottom spacer for vertical transistors202010,741,663Encapsulation layer for vertical transport field-effect transistor gate stack202010,741,401Self-aligned semiconductor gate cut202010,692,778Gate-all-around FETs having uniform threshold voltage202010,692,873Gate formation scheme for nanosheet transistors having different work function metals and different nanosheet width dimensions202010,692,990Gate cut in RMG202010,679,993Vertical fin field effect transistor devices with a replacement metal gate202010,680,083Oxide isolated fin-type field-effect transistors202010,679,901Differing device characteristics on a single wafer by selective etch202010,672,905Replacement metal gate process for vertical transport field-effect transistor with self-aligned shared contacts202010,672,910Threshold voltage adjustment from oxygen vacancy by scavenge metal filling at gate cut (CT)202010,672,670Replacement metal gate process for vertical transport field-effect transistors with multiple threshold voltages202010,658,521Enabling residue free gap fill between nanosheets202010,658,299Replacement metal gate processes for vertical transport field-effect transistor202010,658,973Reconfigurable allocation of VNCAP inter-layer vias for co-tuning of L and C in LC tank202010,644,129Gate cut in RMG202010,629,495Low undercut N-P work function metal patterning in nanosheet replacement metal gate process202010,622,489Vertical tunnel FET with self-aligned heterojunction202010,615,083Formation of common interfacial layer on Si/SiGe dual channel complementary metal oxide semiconductor device202010,615,082VFET metal gate patterning for vertical transport field effect transistor202010,608,121FinFET transistor gate and epitaxy formation202010,607,990Fabrication of field effect transistors with different threshold voltages through modified channel interfaces202010,600,884Additive core subtractive liner for metal cut etch processes202010,586,767Hybrid BEOL metallization utilizing selective reflection mask202010,586,854Gate-all-around field effect transistor having multiple threshold voltages202010,580,881Approach to control over-etching of bottom spacers in vertical fin field effect transistor devices202010,553,498Integrated circuit with replacement gate stacks and method of forming same202010,553,700Gate cut in RMG202010,546,787Multi-metal dipole doping to offer multi-threshold voltage pairs without channel doping for highly scaling CMOS device202010,535,517Gate stack designs for analog and logic devices in dual channel Si/SiGe CMOS202010,529,815Conformal replacement gate electrode for short channel devices202010,529,628Semiconductor device and method of forming the semiconductor device202010,490,559Gate formation scheme for nanosheet transistors having different work function metals and different nanosheet width dimensions201910,468,412Formation of a semiconductor device with selective nitride grown on conductor201910,439,043Formation of self-aligned bottom spacer for vertical transistors201910,418,288Techniques for forming different gate length vertical transistors with dual gate oxide201910,395,989Multi-layer work function metal gates with similar gate thickness to achieve multi-Vt for vFETs201910,395,988Vertical FET transistor with reduced source/drain contact resistance201910,381,479Interface charge reduction for SiGe surface201910,373,912Replacement metal gate processes for vertical transport field-effect transistor201910,361,132Structures with thinned dielectric material201910,361,130Dual channel silicon/silicon germanium complementary metal oxide semiconductor performance with interface engineering201910,354,999Structure and method to suppress work function effect by patterning boundary proximity in replacement metal gate201910,340,340Multiple-threshold nanosheet transistors201910,332,883Integrated metal gate CMOS devices201910,325,815Vertical transport fin field effect transistors having different channel lengths201910,312,147Multi-layer work function metal gates with similar gate thickness to achieve multi-VT for VFETs201910,312,157Field effect transistor stack with tunable work function201910,312,237Vertical transport transistors with equal gate stack thicknesses201910,297,671Uniform threshold voltage for nanosheet devices201910,297,598Formation of full metal gate to suppress interficial layer growth201910,283,620Approach to control over-etching of bottom spacers in vertical fin field effect transistor devices201910,276,687Formation of self-aligned bottom spacer for vertical transistors201910,276,452Low undercut N-P work function metal patterning in nanosheet replacement metal gate process201910,263,098Threshold voltage modulation through channel length adjustment201910,256,159Formation of common interfacial layer on Si/SiGe dual channel complementary metal oxide semiconductor device201910,249,543Field effect transistor stack with tunable work function201910,242,919Vertical transport fin field effect transistors having different channel lengths201910,243,055Shared metal gate stack with tunable work function201910,236,219VFET metal gate patterning for vertical transport field effect transistor201910,224,419Threshold voltage modulation through channel length adjustment201910,204,828Enabling low resistance gates and contacts integrated with bilayer dielectrics201910,170,640FinFET transistor gate and epitaxy formation201910,170,593Threshold voltage modulation through channel length adjustment201910,170,477Forming MOSFET structures with work function modification201910,157,923Vertical transport transistors with equal gate stack thicknesses201810,147,725Forming MOSFET structures with work function modification201810,134,642Semiconductor device and method of forming the semiconductor device201810,128,372Bottom contact resistance reduction on VFET201810,128,347Gate-all-around field effect transistor having multiple threshold voltages201810,109,722Etch-resistant spacer formation on gate structure201810,103,147Vertical transport transistors with equal gate stack thicknesses201810,084,055Uniform threshold voltage for nanosheet devices201810,084,082Bottom contact resistance reduction on VFET201810,079,182Field effect transistor gate stack201810,074,574Integrated circuit with replacement gate stacks and method of forming same201810,068,805Self-aligned spacer for cut-last transistor fabrication201810,032,856Nanosheet capacitor201810,020,255Integration of super via structure in BEOL201810,020,254Integration of super via structure in BEOL201810,020,378Self-aligned spacer for cut-last transistor fabrication201810,008,417Vertical transport fin field effect transistors having different channel lengths201810,002,937Shared metal gate stack with tunable work function201810,002,791Multi-layer work function metal gates with similar gate thickness to achieve multi-Vt for vFETS20189,997,518Low resistive electrode for an extendable high-k metal gate stack20189,997,519Dual channel structures with multiple threshold voltages20189,960,161Low resistive electrode for an extendable high-k metal gate stack20189,960,272Bottom contact resistance reduction on VFET20189,941,282Integrated metal gate CMOS devices20189,922,984'Threshold voltage modulation through channel length adjustment'20189,922,884'Integrated circuit with replacement gate stacks and method of forming same'20189,922,983'Threshold voltage modulation through channel length adjustment'20189,917,210'FinFET transistor gate and epitaxy formation'20189,905,476'Alternative threshold voltage scheme via direct metal gate patterning for high performance CMOS FinFETs'20189,899,264'Integrated metal gate CMOS devices'20189,859,169'Field effect transistor stack with tunable work function'20189,818,746'Structure and method to suppress work function effect by patterning boundary proximity in replacement metal gate'20179,799,656'Semiconductor device having a gate stack with tunable work function'20179,768,171'Method to form dual tin layers as pFET work metal stack'20179,704,758'Forming a semiconductor structure for reduced negative bias temperature instability'20179,704,754'Self-aligned spacer for cut-last transistor fabrication'20179,691,655'Etch stop in a dep-etch-dep process'20179,589,806'Integrated circuit with replacement gate stacks and method of forming same'20179,583,400'Gate stack with tunable work function'20179,576,958'Forming a semiconductor structure for reduced negative bias temperature instability'20179,559,016'Semiconductor device having a gate stack with tunable work function'20179,553,092'Alternative threshold voltage scheme via direct metal gate patterning for high performance CMOS FinFETs'20179,502,307'Forming a semiconductor structure for reduced negative bias temperature instability'20169,343,372'Metal stack for reduced gate resistance'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2021Patents assigned to IBM (128)· patent assignee history
2016–2019Patents assigned to GLOBALFOUNDRIES INC (6)· patent assignee history
2016–2021Based in Wappingers Falls, NY, US· patent location history
2017–2021Based in Niskayuna, NY, US· patent location history
2018Based in Nisakayuna, NY, US· patent location history
2020Patents assigned to ELPIS TECH INC (1)· patent assignee history
2020Patents assigned to ULVAC INC (1)· patent assignee history
2020Based in Nishayuna, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 128 | 2016–2021 |
| GLOBALFOUNDRIES INC | 6 | 2016–2019 |
| ELPIS TECH INC | 1 | 2020 |
| ULVAC INC | 1 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Niskayuna, New York, US | 93 | 2017–2021 |
| Wappingers Falls, New York, US | 39 | 2016–2021 |
| Nishayuna, New York, US | 1 | 2020 |
| Nisakayuna, New York, US | 1 | 2018 |