Inventor

Hans-Joachim Schulze

Inventor
Taufkirchen, DE

Overview

535→
Patents
1988–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 535 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Dprimary
H10DInorganic electric semiconductor devices34%
H01LSemiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
C30BSingle-crystal growth2%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests1%
H03KPulse technique1%
H10BElectronic memory devices1%
Y10TTechnical subjects covered by former us classification1%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation1%
PatentTitleYear
11,121,242Method of operating a semiconductor device having a desaturation channel structure202111,107,893Method for forming a semiconductor device and a semiconductor device202111,107,732Methods for processing a wide band gap semiconductor wafer, methods for forming a plurality of thin wide band gap semiconductor wafers, and wide band gap semiconductor wafers202111,101,343Silicon carbide field-effect transistor including shielding areas202111,094,779Semiconductor device having an edge termination region comprising a first edge termination region of a second conductivity type adjacent to a second edge termination region of a first conductivity type202111,081,393Method for splitting semiconductor wafers202111,081,544Method of manufacturing a semiconductor device comprising first and second field stop zone portions202111,069,626Molding compound and semiconductor package with a molding compound202111,063,142Semiconductor device including silicon carbide body and method of manufacturing202111,043,384Method of manufacturing a semiconductor device by using ion beam technique202111,038,028Semiconductor device and manufacturing method202111,031,483Forming semiconductor devices in silicon carbide202111,018,252Power semiconductor transistor202111,018,249Semiconductor component with edge termination region202111,018,051Power semiconductor device with reliably verifiable p-contact and method202110,868,159Power semiconductor device202010,837,120Method of manufacturing CZ silicon wafers, and method of manufacturing a semiconductor device202010,833,218Semiconductor wafers and semiconductor devices with barrier layer and methods of manufacturing202010,825,716Method for manufacturing a semiconductor device202010,790,384Power semiconductor device having overvoltage protection202010,777,506Silicon carbide semiconductor device having a metal adhesion and barrier structure and a method of forming such a semiconductor device202010,734,507Method of operating a semiconductor device having a desaturation channel structure and related methods of manufacture202010,724,148Silicon ingot and method of manufacturing a silicon ingot202010,724,149Method of manufacturing CZ silicon wafers, and method of manufacturing a semiconductor device202010,714,377Semiconductor device and semiconductor wafer including a porous layer and method of manufacturing202010,707,865Switch device202010,700,168Wide band gap semiconductor device and a method for forming a wide band gap semiconductor device202010,680,089Semiconductor device having an active trench and a body trench202010,679,855Method for producing a superjunction device202010,679,978Chip module with spatially limited thermally conductive mounting body202010,679,857Vertical transistor with trench gate insulator having varying thickness202010,672,875Silicon carbide semiconductor device and a method for forming a silicon carbide semiconductor device202010,670,474Temperature sensor202010,665,705Semiconductor device with deep diffusion region202010,665,687Method for processing a semiconductor device and semiconductor device202010,658,497Method for manufacturing semiconductor devices with superjunction structures202010,651,140Semiconductor device with metal structure electrically connected to a conductive structure202010,651,037Method for fabricating a doped zone in a semiconductor body202010,643,897Method of forming a semiconductor device202010,644,496Semiconductor device with surge current protection202010,629,676Semiconductor device with cell trench structures and recessed contacts and method of manufacturing a semiconductor device202010,622,268Apparatus and method for ion implantation202010,615,039Semiconductor device having a device doping region of an electrical device arrangement202010,607,839Method of reducing an impurity concentration in a semiconductor body202010,580,653Method of forming a semiconductor device202010,566,462Bipolar semiconductor device and manufacturing method202010,566,198Doping method202010,566,426Forming silicon oxide layers by radical oxidation and semiconductor device with silicon oxide layer202010,566,424Semiconductor device, silicon wafer and method of manufacturing a silicon wafer202010,553,675Isolation of semiconductor device with buried cavity202010,546,939N-channel bipolar power semiconductor device with P-layer in the drift volume202010,541,301SiC-based superjunction semiconductor device202010,535,553Devices with backside metal structures and methods of formation thereof202010,535,743Metallization and its use in, in particular, an IGBT or a diode202010,529,809Method of manufacturing a power semiconductor device202010,529,838Semiconductor device having a variable carbon concentration202010,516,065Semiconductor devices and methods for forming semiconductor devices201910,497,801Method of manufacturing a semiconductor device having an undulated profile of net doping in a drift zone201910,497,583Method for manufacturing a semiconductor device comprising etching a semiconductor material201910,490,656Charge-compensation semiconductor device and a manufacturing method therefor201910,483,384Transistor device with high current robustness201910,475,911Semiconductor device having a source region with chalcogen atoms201910,475,881Semiconductor devices with steep junctions and methods of manufacturing thereof201910,475,743Semiconductor device having a metal adhesion and barrier structure and a method of forming such a semiconductor device201910,475,910Semiconductor device having an insulated gate bipolar transistor arrangement201910,468,148Apparatus and method for neutron transmutation doping of semiconductor wafers201910,461,739Transistor device201910,439,025Method for producing a semiconductor body having a recombination zone, semiconductor component having a recombination zone, and method for producing such a semiconductor component201910,431,681Semiconductor devices and a method for forming a semiconductor device201910,410,911Buried insulator regions and methods of formation thereof201910,411,097Semiconductor component having a doped substrate layer and corresponding methods of manufacturing201910,403,556Semiconductor device including a heat sink structure201910,404,250Transistor device201910,396,170Semiconductor devices and methods for forming semiconductor devices201910,388,722Power semiconductor device termination structure201910,388,776Semiconductor device having an active trench and a body trench201910,381,467Semiconductor device with separation regions201910,367,067Semiconductor device having an oxygen diffusion barrier201910,366,895Methods for forming a semiconductor device using tilted reactive ion beam201910,355,116Power semiconductor device201910,347,723Method of manufacturing a semiconductor device having graphene material201910,340,335Method of forming a semiconductor device201910,340,264Semiconductor device comprising a clamping structure201910,337,117Method of manufacturing a silicon ingot and silicon ingot201910,332,973N-channel bipolar power semiconductor device with p-layer in the drift volume201910,325,804Method of wafer thinning and realizing backside metal structures201910,325,809Methods for splitting semiconductor devices and semiconductor device201910,325,996Method for producing a doped semiconductor layer201910,317,338Method and assembly for determining the carbon content in silicon201910,319,599Methods of planarizing SiC surfaces201910,312,258Semiconductor device with buried cavities and dielectric support structures201910,273,597Method of manufacturing CZ silicon wafers, and method of manufacturing a semiconductor device201910,276,656Method of manufacturing semiconductor devices by using epitaxy and semiconductor devices with a lateral structure201910,269,896Semiconductor wafer and method of manufacturing semiconductor devices in a semiconductor wafer201910,263,101Semiconductor device with deep diffusion region201910,249,746Bipolar transistor with superjunction structure201910,243,066Producing a semiconductor device by epitaxial growth201910,229,990Semiconductor device having a desaturation channel structure for desaturating a charge carrier concentration in an IGBT cell201910,224,206Bipolar transistor device with an emitter having two types of emitter regions201910,217,638Method for removing crystal originated particles from a crystalline silicon body using an etch process201910,217,837Method of manufacturing a semiconductor device having electrode trenches, isolated source zones and separation structures201910,211,325Semiconductor device including undulated profile of net doping in a drift zone201910,211,057Transistor component with reduced short-circuit current201910,205,011Method for forming a semiconductor device with implanted chalcogen atoms201910,199,526Radiation detector and a method for forming a semiconductor device201910,199,332Method of manufacturing a semiconductor device comprising a support element and semiconductor device comprising a support element201910,192,955Semiconductor device containing oxygen-related thermal donors201910,186,587Power semiconductor device201910,177,033Methods for forming a semiconductor device and semiconductor devices201910,177,230Semiconductor device including at least one type of deep-level dopant201910,170,497Method for manufacturing an electronic device and method for operating an electronic device201910,164,019Semiconductor device and a method for forming a semiconductor201810,164,043Semiconductor diode and method for forming a semiconductor diode201810,158,356Switch device201810,153,339Semiconductor device and method for forming a semiconductor device201810,147,786Power semiconductor device with charge balance design201810,134,845Method and power semiconductor device having an insulating region arranged in an edge termination region201810,134,848Semiconductor device having a graphene layer, and method of manufacturing thereof201810,134,853Method of manufacturing a semiconductor device having an impurity concentration201810,134,885Semiconductor device having an active trench and a body trench201810,128,328Method of manufacturing semiconductor devices and semiconductor device containing hydrogen-related donors201810,121,691Semiconductor substrate arrangements and a method for forming a semiconductor substrate arrangement201810,109,489Method for producing a superjunction device201810,103,227Method for manufacturing a power semiconductor device201810,096,677Methods for forming a semiconductor device and a semiconductor device201810,090,265Semiconductor device with metal structure electrically connected to a conductive structure201810,083,835Forming electrode trenches by using a directed ion beam and semiconductor device with trench electrode structures201810,079,217Power semiconductor device load terminal201810,074,715Semiconductor wafer, implantation apparatus for implanting protons and method for forming a semiconductor device201810,069,016Semiconductor diode with trench structures and including doped layers and doped zones of opposite conductivity types providing high surge energy capacity201810,049,914Method for thinning substrates201810,043,866Semiconductor device and a method for forming a semiconductor device201810,038,105Semiconductor devices, a semiconductor diode and a method for forming a semiconductor device201810,038,052Semiconductor device with channelstopper and method for producing the same201810,037,887Method for implanting ions into a semiconductor substrate and an implantation system201810,026,816Semiconductor wafer and manufacturing method201810,020,388Insulated gate bipolar transistor including charge injection regions201810,020,226Method for forming a semiconductor device and a semiconductor device201810,014,400Semiconductor device having a defined oxygen concentration201810,014,383Method for manufacturing a semiconductor device comprising a metal nitride layer and semiconductor device201810,002,930Forming a contact layer on a semiconductor body20189,997,359Semiconductor device with rear-side insert structure20189,985,017Semiconductor device comprising a clamping structure20189,978,851n-channel bipolar power semiconductor device with p-layer in the drift volume20189,972,613Semiconductor device including a phase change material20189,972,488Method of reducing defects in an epitaxial layer20189,972,689Semiconductor device having a surface with ripples20189,972,704Method for forming a semiconductor device and a semiconductor device20189,960,076Devices with backside metal structures and methods of formation thereof20189,960,044Semiconductor device and methods for forming a semiconductor device20189,954,065Method of forming a semiconductor device and semiconductor device20189,947,741Field-effect semiconductor device having pillar regions of different conductivity type arranged in an active area20189,935,126Method of forming a semiconductor substrate with buried cavities and dielectric support structures20189,934,988Method for processing a silicon wafer20189,929,181'Method for manufacturing an electronic device and method for operating an electronic device'20189,917,186'Semiconductor device with control structure including buried portions and method of manufacturing'20189,917,181'Bipolar transistor with superjunction structure'20189,911,808'Method for forming a semiconductor device and a semiconductor device'20189,911,610'Semiconductor device having a metal-semiconductor junction and manufacturing therefor'20189,905,655'Method for reducing bipolar degradation in an SIC semiconductor device and semiconductor device'20189,905,634'Power semiconductor device edge structure'20189,899,377'Insulated gate semiconductor device with soft switching behavior'20189,899,504'Power semiconductor transistor having increased bipolar amplification'20189,887,125'Method of manufacturing a semiconductor device comprising field stop zone'20189,882,038'Method of manufacturing a bipolar semiconductor switch'20189,876,004Semiconductor component including a short-circuit structure20189,875,926Substrates with buried isolation layers and methods of formation thereof20189,876,100Semiconductor device and reverse conducting insulated gate bipolar transistor with isolated source zones20189,875,935Semiconductor device and method for producing the same20189,871,126'Discrete semiconductor transistor'20189,859,383'Schottky diode with reduced forward voltage'20189,859,272'Semiconductor device with a reduced band gap zone'20189,859,361'SiC-based superjunction semiconductor device'20189,859,362'Processing a semiconductor wafer'20189,853,137Method for forming a semiconductor device and a semiconductor device20179,847,229Method for forming a semiconductor device and semiconductor device20179,842,904'Method of manufacturing a semiconductor device having a trench at least partially filled with a conductive material in a semiconductor substrate'20179,837,506Method of manufacturing a semiconductor device having electrode trenches, isolated source zones and separation structures20179,825,131'Method of manufacturing semiconductor devices and semiconductor device containing oxygen-related thermal donors'20179,825,136'Semiconductor component and integrated circuit'20179,809,877'Ion implantation apparatus with ion beam directing unit'20179,799,521'Semiconductor device having areas with different conductivity types and different doping'20179,793,255'Power semiconductor device including a cooling material'20179,793,362'Semiconductor device having an impurity concentration and method of manufacturing thereof'20179,786,748'Semiconductor device, silicon wafer and silicon ingot'20179,779,931'Method of manufacturing semiconductor wafers and method of manufacturing a semiconductor device'20179,754,787'Method for treating a semiconductor wafer'20179,748,102'Semiconductor chip arrangement and method thereof'20179,748,374'Semiconductor device having a field-effect structure and a nitrogen concentration profile'20179,741,795'IGBT having at least one first type transistor cell and reduced feedback capacitance'20179,741,571'Bipolar transistor device with an emitter having two types of emitter regions'20179,728,627'Method for forming a semiconductor device and a semiconductor device'20179,728,395'Method for manufacturing a semiconductor wafer, and semiconductor device having a low concentration of interstitial oxygen'20179,722,020'Super junction semiconductor device having columnar super junction regions extending into a drift layer'20179,721,907'Wafer edge shape for thin wafer processing'20179,716,227'Method of forming a graphene structure'20179,711,660'JFET and method of manufacturing thereof'20179,704,750'Method for forming a semiconductor device and a semiconductor device'20179,698,138'Power semiconductor device with improved stability and method for producing the same'20179,698,247'Method of producing a semiconductor arrangement'20179,691,892'High voltage transistor operable with a high gate voltage'20179,679,892'Method of manufacturing a reverse blocking semiconductor device'20179,680,005'Semiconductor device having an active trench and a body trench'20179,679,774'Method for removing crystal originated particles from a crystalline silicon body'20179,666,663'Semiconductor device with cell trench structures and contacts and method of manufacturing a semiconductor device'20179,660,029'Semiconductor device having a positive temperature coefficient structure'20179,653,540'Semiconductor wafer and method of manufacturing semiconductor devices in a semiconductor wafer'20179,653,568'Method of manufacturing an insulated gate bipolar transistor with mesa sections between cell trench structures'20179,653,296'Method for processing a semiconductor device and semiconductor device'20179,647,100'Semiconductor device with auxiliary structure including deep level dopants'20179,647,083'Producing a semiconductor device by epitaxial growth'20179,640,401'Method of manufacturing a semiconductor device having a rear-side insert structure'20179,634,086'Method of manufacturing semiconductor devices using light ion implantation and semiconductor device'20179,634,081'Methods for producing polysilicon resistors'20179,627,517'Bipolar semiconductor switch and a manufacturing method therefor'20179,627,209'Method for producing a semiconductor'20179,621,133'Method of operating a semiconductor device having an IGBT and desaturation channel structure'20179,613,804'Method of manufacturing semiconductor devices which allows reproducible thinning of a semiconductor body of the semiconductor devices'20179,608,092'Method of manufacturing a semiconductor device having a rectifying junction at the side wall of a trench'20179,608,128'Body of doped semiconductor material having scattering centers of non-doping atoms of foreign matter disposed between two layers of opposing conductivities'20179,601,376'Semiconductor device and method of manufacturing a semiconductor device having a glass piece and a single-crystalline semiconductor portion'20179,601,368'Semiconductor device comprising an oxygen diffusion barrier and manufacturing method'20179,595,619'Semiconductor device with different contact regions'20179,595,577'Semiconductor device with trench structure and methods of manufacturing'20179,583,578'Semiconductor device including an edge area and method of manufacturing a semiconductor device'20179,576,844'Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core'20179,577,080'Power semiconductor device'20179,576,944'Semiconductor devices with transistor cells and thermoresistive element'20179,570,577'Semiconductor device and insulated gate bipolar transistor with source zones formed in semiconductor mesas'20179,570,607'Field-effect semiconductor device having alternating n-type and p-type pillar regions arranged in an active area'20179,570,566'Semiconductor device including a trench at least partially filled with a conductive material in a semiconductor substrate'20179,570,576'Method for forming a semiconductor device having insulating parts or layers formed via anodic oxidation'20179,564,495'Semiconductor device with a semiconductor body containing hydrogen-related donors'20179,560,765'Electronic device, a method for manufacturing an electronic device, and a method for operating an electronic device'20179,559,020'Method for postdoping a semiconductor wafer'20179,558,933'Method for forming a semiconductor device'20179,553,178'Semiconductor component with an emitter control electrode'20179,548,399'Junction field effect transistor cell with lateral channel region'20179,543,405'Method of manufacturing a reduced free-charge carrier lifetime semiconductor structure'20179,536,740'Increasing the doping efficiency during proton irradiation'20179,536,838'Single crystal ingot, semiconductor wafer and method of manufacturing semiconductor wafers'20179,536,958'Semiconductor substrate and a method of manufacturing the same'20179,536,999'Semiconductor device with control structure including buried portions and method of manufacturing'20179,525,043'Semiconductor device and method of manufacturing a semiconductor device'20169,515,149'Power semiconductor device'20169,515,066'Semiconductor device having an insulated gate bipolar transistor arrangement and a method for forming such a semiconductor device'20169,515,243'Temperature sensor'20169,508,812'Semiconductor device'20169,508,711'Semiconductor device with bipolar junction transistor cells'20169,496,351'Semiconductor chip arrangement'20169,496,364'Field effect semiconductor component and methods for operating and producing it'20169,496,346'Silicon carbide device and a method for forming a silicon carbide device'20169,496,337'Method for producing a semiconductor device having a beveled edge termination'20169,490,354'Insulated gate bipolar transistor'20169,472,395'Semiconductor arrangement including buried anodic oxide and manufacturing method'20169,449,847'Method for manufacturing a semiconductor device by thermal treatment with hydrogen'20169,431,490'Power semiconductor device and method'20169,425,063'Method of reducing an impurity concentration in a semiconductor body, method of manufacturing a semiconductor device and semiconductor device'20169,425,327'Junction field effect transistor cell with lateral channel region'20169,419,080'Semiconductor device with recombination region'20169,412,854'IGBT module and a circuit'20169,412,824'Semiconductor component having a dopant region formed by a dopant composed of an oxygen/vacancy complex'20169,412,813'Semiconductor body with a buried material layer and method'20169,412,808'Silicon carbide device and a method for manufacturing a silicon carbide device'20169,406,551'Method for manufacturing a semiconductor substrate, and method for manufacturing semiconductor devices integrated in a semiconductor substrate'20169,406,564'Singulation through a masking structure surrounding expitaxial regions'20169,390,883'Implantation apparatus with ion beam directing unit, semiconductor device and method of manufacturing'20169,385,222'Semiconductor device with insert structure at a rear side and method of manufacturing'20169,384,960'Method of manufacturing a semiconductor device with a continuous silicate glass structure'20169,373,692'Method for forming a semiconductor device with an integrated poly-diode'20169,362,349'Semiconductor device with charge carrier lifetime reduction means'20169,349,804'Composite wafer for bonding and encapsulating an SiC-based functional layer'20169,349,792'Super junction semiconductor device having columnar super junction regions'20169,312,135'Method of manufacturing semiconductor devices including generating and annealing radiation-induced crystal defects'20169,312,120'Method for processing an oxygen containing semiconductor body'20169,312,334'Semiconductor component'20169,306,010'Semiconductor arrangement'20169,306,011'Semiconductor device having areas with different conductivity types and different doping concentrations'20169,293,330'Method for producing a semiconductor'20169,287,377'Semiconductor device and manufacturing method'20169,281,360'Semiconductor device with a shielding structure'20169,269,769'Semiconductor component including a short-circuit structure'20169,269,713'Semiconductor device and method for producing the same'20169,263,271'Method for processing a semiconductor carrier, a semiconductor chip arrangement and a method for manufacturing a semiconductor device'20169,257,511'Silicon carbide device and a method for forming a silicon carbide device'20169,252,045'Method for manufacturing a composite wafer having a graphite core'20169,252,292'Semiconductor device and a method for forming a semiconductor device'20169,245,811'Method for postdoping a semiconductor wafer'20169,245,984'Reverse blocking semiconductor device, semiconductor device with local emitter efficiency modification and method of manufacturing a reverse blocking semiconductor device'20169,246,410'Integrated power semiconductor component, production method and chopper circuit comprising integrated semiconductor component'20169,245,760'Methods of forming epitaxial layers on a porous semiconductor layer'20169,245,943'Semiconductor body with strained monocrystalline region'20169,236,458'Bipolar transistor and a method for manufacturing a bipolar transistor'20169,231,091'Semiconductor device and reverse conducting insulated gate bipolar transistor with isolated source zones'20169,224,806'Edge termination structure with trench isolation regions'20159,224,633'Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core'20159,219,144'Semiconductor device including a trench in a semiconductor substrate and method of manufacturing a semiconductor device'20159,219,020'Semiconductor device, wafer assembly and methods of manufacturing wafer assemblies and semiconductor devices'20159,218,958'Method for forming a semiconductor device'20159,219,143'Semiconductor device and super junction semiconductor device having semiconductor mesas'2015

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1988–1989Based in Anzing, DE· patent location history
1991–2020Based in Ottobrunn, DE· patent location history
2002–2021Patents assigned to INFINEON TECHNOLOGIES AG (347)· patent assignee history
2005–2017Patents assigned to SCHULZE HANS-JOACHIM (95)· patent assignee history
2008–2016Patents assigned to INFINEON TECHNOLOGIES AUSTRIA (115)· patent assignee history
2009–2021Based in Taufkirchen, DE· patent location history
2011Based in Ottoburn, DE· patent location history
2012–2020Patents assigned to MAUDER ANTON (41)· patent assignee history
2016–2020Patents assigned to INFINEON TECHNOLOGIES AUSTRIA AG (44)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INFINEON TECHNOLOGIES AG3472002–2021
INFINEON TECHNOLOGIES AUSTRIA1152008–2016
SCHULZE HANS-JOACHIMself952005–2017
INFINEON TECHNOLOGIES AUSTRIA AG442016–2020
MAUDER ANTON412012–2020
Locations
LocationPatentsSpan
Taufkirchen, DE4262009–2021
Ottobrunn, DE1061991–2020
Anzing, DE21988–1989
Ottoburn, DE12011